Encapsulation Structure With Aluminum Carbon Layer For OLED Devices

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Solution Overview

Problem

Electronic devices, such as OLED devices, have a poor resistance to water vapor and oxygen, leading to reduced lifetimes due to cracking in inorganic encapsulation layers and low bonding strength between inorganic and organic layers.

Innovation Solution

An encapsulation structure comprising an inorganic layer, an aluminum carbon layer, and an organic layer, where the aluminum carbon layer is formed by reacting an aluminum film with an organic material layer, enhancing the bonding strength between the inorganic and organic layers and improving the device's ability to resist moisture and oxygen.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thin film encapsulation technology is used with inorganic and organic layers, then the encapsulation ability is improved, but the bonding strength between layers is insufficient causing delamination

Engineering Contradiction:

Improveencapsulation abilityVSAvoidbonding strength between layers

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

An aluminum carbon layer is introduced as an intermediate layer between the inorganic encapsulation layer and the organic encapsulation layer. This intermediate layer serves as a bonding bridge that enhances adhesion between the two encapsulation layers, preventing delamination while maintaining the protective encapsulation function.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The aluminum carbon layer is formed by reacting aluminum with carbon-containing compounds, creating a composite material with enhanced bonding properties. This composite layer combines characteristics of both inorganic and organic materials, enabling strong bonding to both encapsulation layers.

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If inorganic encapsulation layers are used, then the resistance to water vapor and oxygen is improved, but cracking occurs reducing device lifetime

Engineering Contradiction:

Improveresistance to water vapor and oxygenVSAvoiddevice lifetime

Core Design Contradiction:

Object-affected harmful factorsVSDuration of action of stationary object

Solution Approach 1:

The aluminum carbon layer and organic encapsulation layer form a flexible protective structure that can accommodate stress and deformation without cracking. This flexible structure maintains the barrier function against water vapor and oxygen while preventing the cracking that would otherwise occur in rigid inorganic layers.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The multi-layer composite structure combines the barrier properties of inorganic layers with the flexibility and crack resistance of the aluminum carbon and organic layers, creating an encapsulation system that maintains both protection and durability.

Inventive Principle:

Principle #40Composite materials

3Strength

If aluminum film reacts with organic material layer to form aluminum carbon layer, then the bonding strength is improved through chemical bonding, but the manufacturing process complexity increases

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The formation of the aluminum carbon layer through chemical reaction merges multiple functions into a single layer: it provides bonding to the inorganic layer, bonding to the organic layer, and acts as a barrier. This consolidation reduces the need for separate functional layers and simplifies the overall structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The aluminum carbon layer is formed by controlling the reaction parameters (temperature, atmosphere, reaction time) during the manufacturing process. By optimizing these parameters, the layer forms with the desired properties without requiring additional complex processing steps.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The encapsulation structure effectively prevents delamination and warpage, extends the lifetime of electronic devices by improving the sealing effect and adapting to flexible devices, with a higher bonding strength achieved through chemical bonding forces.

Implementation Method 1

the aluminum carbon layer is formed by reacting an aluminum film with an organic material layer, enhancing the bonding strength between the inorganic and organic layers with a higher bonding strength achieved through chemical bonding forces

Methodology Applied

Scientific EffectChemical bonding: Chemical Bonding

Data Source

PatentUS10879488B2Encapsulation structure, electronic device and encapsulation method

Publication Date: 2020.12.29 BOE TECHNOLOGY GROUP CO LTD

AI summary

An encapsulation structure, an encapsulation method and an electronic device are provided. The encapsulation structure includes an inorganic layer, an aluminum carbon layer and an organic layer. The aluminum carbon layer is on the inorganic layer and contacts with the inorganic layer; the organic layer is on the aluminum carbon layer and contacts with the aluminum carbon layer.