Aluminum Oxide Composite Package Structure for Warping Prevention
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Solution Overview
Problem
Conventional semiconductor package structures with embedded chips face issues of warping due to asymmetric build-up structures, leading to low yield and stability, and existing materials like copper or bismaleimide-triazine (BT) resin fail to address these problems effectively.
Innovation Solution
A package structure using an aluminum oxide composite plate with an adhesive layer between two aluminum oxide plates, embedding the semiconductor chip in a cavity, and forming a build-up structure with a dielectric layer and conductive structures to secure and connect the chip, utilizing materials like epoxy resin and copper for stability and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an asymmetric build-up structure is used to conduct electrode pads, then electrical connection is achieved, but the carrier becomes warped due to stress imbalance
Solution Approach 1:
The patent applies asymmetry principle by intentionally designing the build-up structure to be asymmetric, matching the asymmetric arrangement of electrode pads on the semiconductor chip. This allows the conductive structures to efficiently connect to all electrode pads while the aluminum oxide composite plate compensates for the resulting stress imbalance, preventing warping of the overall carrier structure.
Solution Approach 2:
The patent changes the material parameter of the carrier from conventional materials (copper or BT resin) to aluminum oxide composite plate, which has superior mechanical properties including higher modulus of elasticity and better stress distribution characteristics. This parameter change enables the carrier to withstand the asymmetric build-up structure without warping.
2Ease of manufacture
If conventional materials (copper or BT resin) are used for the carrier, then manufacturing is easier, but the carrier cannot prevent warping and has low yield
Solution Approach 1:
The patent uses composite materials by combining aluminum oxide plates with an adhesive layer in between, creating an aluminum oxide composite plate structure. This composite structure provides both the mechanical strength needed to prevent warping and the manufacturability required for mass production, achieving high production yield while maintaining carrier flatness.
Solution Approach 2:
The patent segments the carrier structure into multiple aluminum oxide plates connected by adhesive layers, allowing for modular manufacturing and assembly. This segmentation enables easier fabrication processes while maintaining the overall structural integrity and warping resistance of the complete carrier.
3Reliability
If the build-up structure is made asymmetric to match chip electrode pads, then electrical conductivity is improved, but stress distribution becomes uneven causing warping
Solution Approach 1:
The patent applies local quality principle by concentrating the asymmetric build-up structure and conductive elements only in the regions where electrode pads are located, while the aluminum oxide composite plate provides uniform structural support across the entire carrier area. This localized approach maintains efficient electrical pathways while the overall symmetric composite structure ensures uniform stress distribution.
Data Source
AI summary
A package structure having a semiconductor chip embedded therein and a method of fabricating the same are disclosed. The package structure comprises: an aluminum oxide composite plate and a semiconductor chip. The aluminum oxide composite plate is formed by a stack consisting of an adhesive layer placed in between two aluminum oxide layers. The semiconductor chip having an active surface a plurality of electrode pads disposed thereon can be embedded and secured in the aluminum oxide composite plate. The present invention also comprises a method of fabricating the above-mentioned package structure. The present invention provides an excellent package structure, which can decrease the thickness of the package structure and make the package structure having characteristics of high rigidity and enduring tenacity at the same time.