Ambipolar Transistor Lateral Segmentation for Mobility

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Solution Overview

Problem

Ambipolar transistors with interpenetrating p-type and n-type semiconductors suffer from low mobility due to significant interfacial areas, resulting in impractical mobilities for electronic devices and complex circuit designs, as existing materials fail to achieve balanced mobility and ON current.

Innovation Solution

Designing an ambipolar transistor with laterally deposited p-type and n-type semiconductors that minimize interfacial area, allowing for high mobility and balanced ON current by adjusting the channel width ratio between the semiconductors, even when they have unbalanced mobilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If interpenetrating p-type and n-type semiconductors are used in ambipolar transistor, then both p-type and n-type operations are achieved in a single transistor, but the large interfacial area between semiconductors causes trapping effect and significantly reduces mobility

Engineering Contradiction:
Improveambipolar operation capabilityVSAvoidcarrier mobility
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The semiconductor layer is segmented into distinct p-type and n-type regions that are spatially separated rather than interpenetrating. This segmentation eliminates the large interfacial area between oppositely-doped regions, preventing carrier trapping while maintaining ambipolar functionality through separate contact configurations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a vertical stacked structure to a lateral planar structure where p-type and n-type regions are arranged side-by-side in the same plane. This dimensional change allows both semiconductor types to coexist without significant interface overlap, preserving high mobility while achieving ambipolar operation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If stacked semiconductor structure is used, then fabrication is simplified, but the overlapping surface areas of p-type and n-type semiconductors cause trapping effect and low mobility

Engineering Contradiction:
Improvefabrication simplicityVSAvoidcarrier mobility
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent reconfigures the semiconductor architecture from vertical stacking to lateral planar arrangement. This dimensional transformation maintains fabrication simplicity through single-layer processing while eliminating the interface overlap problem that plagues stacked structures, thereby preserving high carrier mobility.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If unipolar transistors with p-type or n-type semiconductor are used, then high mobility is achieved, but complementary technology for efficient circuits cannot be realized

Engineering Contradiction:
Improvecarrier mobilityVSAvoidcomplementary circuit capability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The ambipolar transistor serves multiple functions within a single device structure, supporting both p-type and n-type carrier transport. This multi-functionality enables complementary circuit operations (such as CMOS logic) using a single transistor type, eliminating the need for separate p-type and n-type transistor fabrication while maintaining high mobility through the lateral semiconductor structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS7652339B2Ambipolar transistor design
Publication Date: 2010.01.26 SAMSUNG ELECTRONICS CO LTD
  • US7652339B2 patent drawing
  • US7652339B2 patent drawing
  • US7652339B2 patent drawing

AI summary

An ambipolar transistor, including a p-type semiconductor region and an n-type semiconductor region near the p-type semiconductor region. Also a first terminal and second terminal contact both the p-type semiconductor region and the n-type semiconductor region. Furthermore, the p-type semiconductor region and the n-type semiconductor region substantially do not overlap each other. A method of manufacturing an ambipolar transistor is also disclosed, including forming a p-type semiconductor region, forming an n-type semiconductor region near the p-type semiconductor region, forming a first terminal contacting both the p-type semiconductor region and n-type semiconductor region, forming a second terminal contacting both the p-type semiconductor region and n-type semiconductor region; and wherein the p-type semiconductor region and the n-type semiconductor region substantially do not overlap, and have substantially no interfacial area.