Anchoring Layer with Predetermined Breaking Position for Component Separation
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Solution Overview
Problem
Existing methods for transferring components, especially thin-film semiconductor bodies, face instability and unreliability due to the need for large lateral anchor structures or delamination layers, which are inefficient and prone to material loss during separation.
Innovation Solution
A method involving an anchoring layer with predetermined breaking layers between components and a carrier, allowing for selective mechanical removal by forming separating trenches and using a sacrificial layer to create precise breaking points, ensuring reliable and targeted component separation without unnecessary material removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If lateral anchor structures are formed next to the components, then the components can be held stable on the carrier, but the surface area required increases when components become smaller
Solution Approach 1:
The patent transitions from lateral anchor structures (horizontal dimension) to vertical anchor structures extending into the depth dimension. The anchor structure penetrates through the component to a support surface, utilizing the vertical dimension to provide stability without increasing lateral surface area requirements.
Solution Approach 2:
The anchor structure is segmented into multiple parts: a first anchor portion extending from the component's upper surface, a second anchor portion on the support surface, and an intermediate portion connecting them. This segmentation allows the anchor to distribute its function across different spatial locations, achieving stable holding with compact lateral footprint.
2Ease of operation
If delamination layers are formed between components and carrier for detachment, then component removal is enabled, but the process becomes unreliable
Solution Approach 1:
The patent extracts the separation function from the interface between component and carrier by introducing a dedicated sacrificial layer. This sacrificial layer is positioned between the component and carrier, and its selective removal creates a separation path, making the detachment process more reliable than relying on delamination at material boundaries.
Solution Approach 2:
The sacrificial layer acts as an intermediary element between the component and the carrier. It facilitates controlled separation by being selectively removable, providing a reliable detachment mechanism that does not depend on the inherent delamination properties of the component-carrier interface.
3Ease of manufacture
If separating trenches are formed to divide composite components, then individual components can be obtained, but unnecessary material removal occurs in the regions of separating trenches
Solution Approach 1:
The patent applies local quality by positioning the sacrificial layer specifically in regions where separation is needed, rather than removing material throughout the entire separating trench region. The sacrificial layer is laterally surrounded by separating trenches but only present where component separation is required, minimizing unnecessary material removal.
Solution Approach 2:
The sacrificial layer is formed in advance during the manufacturing process, before the final separation step. This preliminary action prepares the separation path by placing the sacrificial material in predetermined positions, allowing for clean separation without requiring extensive material removal during the separation process itself.
Data Source
AI summary
A method for producing a component and a component are disclosed. In an embodiment a method includes providing a substrate, applying a composite of components to the substrate, forming an anchoring layer on the composite of components, attaching a carrier to the anchoring layer, wherein the anchoring layer is disposed between the substrate and the carrier and removing the substrate, wherein the composite of components is divided into a plurality of components by forming a plurality of separating trenches, wherein, after removing the substrate, the components continue to be held on the carrier by the anchoring layer, and wherein the anchoring layer comprises at least one predetermined breaking layer having at least one predetermined breaking position, the predetermined breaking position being laterally surrounded by the separating trenches and—in a plan view of the carrier—being covered by one of the components.