Angled Aligning Structure for Electronic Component Positioning
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Solution Overview
Problem
Existing methods for aligning electronic components on carriers are inefficient and time-consuming, particularly in the manufacture of LED color screen display boards, which require precise alignment of millions of LEDs.
Innovation Solution
A device and system with an aligning structure and aligning device that uses complementary angled edges to precisely align electronic components, incorporating passive and active alignment methods such as inclining and vibrating mechanisms, and magnetic forces to facilitate automatic alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sequential alignment of electronic components is used, then alignment precision can be achieved, but production time becomes excessively long
Solution Approach 1:
The alignment process is segmented into two distinct stages: rough alignment during the deposition phase, followed by precise alignment in a separate post-processing phase. This allows parallel processing where multiple components can be deposited simultaneously without requiring sequential precise alignment, thereby reducing production time while maintaining alignment precision through the second alignment device.
Solution Approach 2:
The first alignment device performs preliminary rough alignment of electronic components during the deposition process, positioning components within a coarse alignment range. This preliminary action enables subsequent precise alignment to be performed more efficiently by the second alignment device, as the components are already close to their final positions, reducing the time required for precise alignment.
2Manufacturing precision
If complex alignment mechanisms are used, then alignment precision improves, but device complexity and cost increase
Solution Approach 1:
The alignment system is divided into two separate alignment devices with different complexity levels. The first alignment device uses simple mechanical or magnetic features for rough alignment, while the second alignment device employs more sophisticated sensors and actuators for precise alignment. This segmentation allows each device to be optimized for its specific function, reducing overall system complexity while maintaining high alignment precision.
Solution Approach 2:
The aligning structure incorporates self-aligning features such as complementary geometric shapes, magnetic attraction, or mechanical interlocking that automatically guide the electronic component into the correct position. These self-service mechanisms reduce the need for complex external alignment systems, thereby simplifying device complexity while achieving the required alignment precision.
3Device complexity
If simple aligning structures are used, then device complexity is reduced, but alignment precision deteriorates
Solution Approach 1:
The alignment function is segmented between two devices: the first alignment device uses simple structures for rough positioning, and the second alignment device uses more precise structures for final alignment. This segmentation allows the system to achieve high alignment precision without requiring both devices to be complex, as the simple first device handles the coarse positioning that would otherwise burden the precision device.
Solution Approach 2:
The first alignment device performs preliminary rough alignment using simple structures, bringing the electronic component close to its final position. This preliminary action enables the second alignment device to achieve precise alignment with simpler adjustments and less complex mechanisms, as the component is already near the target position, thereby reducing the complexity requirement for the precision alignment stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and efficient alignment of multiple electronic components simultaneously, reducing production time and complexity, and is cost-effective to produce.
Implementation Method 1
the aligning device is adapted to align the electronic component with the aligning structure by bringing sides of the electronic component into contact both with the first and with the second edge of the aligning structure
Implementation Method 2
the components sliding along the tilted substrate by means of gravity
Implementation Method 3
the document further proposes vibrating the substrate so that a movement of the components on the substrate is promoted
Implementation Method 4
The dish is filled with an adhesive which, due to surface tension, extends slightly beyond the edge of the wall without leaving the dish
Data Source
AI summary
A system for aligning an electronic component including a substrate having an aligning structure and an aligning device for aligning the electronic component with the aligning structure. The aligning structure defines a first and a second edge, which are at an angle relative to one another and are complementary to two sides of the electronic component to be aligned. The aligning device aligns the electronic component on the aligning structure by bringing sides of the electronic component into contact with both the first edge and also the second edge of the aligning structure. A dispensing unit dispensing the electronic component at a dispensing point by the device for aligning the electronic component close to the aligning structure. A receiving unit receives the electronic component aligned on the aligning structure in the device.