Printed Circuit Assembling TRIZ Cases

Segmented backplanes with cut-outs allow module removal without disassembling field-mounted conduit penetrations.

A segmented EMI shield covers the optical unit and circuit substrate of a camera module to block electromagnetic interference.

Nitrogen-containing organic films coat copper bumps to block surface oxidation, avoiding expensive noble metals while maintaining solder joint reliability.

Capacitive sensor electrodes feature recessed gaps filled with low dielectric material to reduce parasitic capacitance between adjacent conductive plates.

Segmented busbar layers join transistor leads to resolve complex connection geometry in compact inverters.

Nesting dies within substrate and board cavities lowers the die-attach plane, reducing z-height while maintaining electrical connectivity.

A flexible printed wiring board uses a columnar metal body fitted through insulating layers to join directly to battery electrodes via welding.

Spiral radiating elements on a PCB reject left-hand circularly polarized multipath signals across wide beamwidths.

Protrusions on an LED package cover abut housing surfaces to position the optical element accurately, reducing scattered light from manufacturing tolerances.

A light regulating member with transmitting regions guides manual alignment of flexible printed circuit board goldfingers to substrate electrodes.

Segmenting the housing and using a flexible cable isolates heat from sensors while maintaining electrical connections.

A mounting structure uses imidazole preflux to form protective films on copper terminal electrodes for stable electrical connections.

An extended module part projects below terminals, and a substrate bypass part prevents interference to increase component density without enlarging device size.

A carrier uses loading and pressing devices to secure electronic components.

A flip-chip package structure integrates switching power supply components using a redistribution layer and lead frame to eliminate bonding wires.

Segmented metallic foils with plating layers resolve manufacturing complexity while enabling miniaturized wiring substrates.

Thicker lower cover layers shift the point of inflection below solder height, preventing resonance transfer to printed circuit boards.

Mechanical exposure of embedded conductive elements reduces board space usage and manufacturing complexity compared to conventional microvia formation.

Offsetting slots in superposed leadframe planes preserves insulator cohesion, preventing short circuits during smart card manufacturing.

Variable terminal pitch and expanded width portions on a wiring substrate reduce resistance and prevent short circuits across varying voltage differences.

Ultrasonic treatment removes oxide films on connection particles before thermo-compression prevents thermal deformation of the camera module.

Line symmetric nozzle patterns in a divided plate ensure uniform heating, resolving temperature distribution issues in reflow furnaces.

A seal board assembly passes electrical signals through a bulkhead using soldered conductor pins and vias.

A low activity flux coating on BGA solder balls prevents paste adhesion during reflow, eliminating non-wet open defects caused by thermal warpage.

Merged adhesive layer eliminates underfill resin to reduce device thickness by 30 μm and enhance moisture resistance.

Nitrogen-containing aromatic heterocyclic compounds in curable inkjet compositions suppress viscosity changes and discoloration during high-temperature storage.

Merging PCBs via solder joints and molding compound reduces form factor size while maintaining design flexibility for compact solid state drives.

Complementary angled edges position electronic components via direct side contact, reducing production time while maintaining alignment precision.

A component mount board uses a same-material surface resin layer to expose land conductors through holes for terminal bonding.

Offsetting terminal grids reduces stub lengths, improving signal quality and simplifying circuit panel manufacturing.

CVDD-coated wires bridge thermal gaps in multi-board assemblies, removing heat from die locations where metallic fins cannot fit.

Liquid dielectric casting encloses components within a solid layer, eliminating pre-routed foils and thickness limits.

Columnar solder parts form with acute contact angles to eliminate shape discontinuities that lower fatigue strength.

A detachable holding means secures command devices to printed circuit boards using latching pins and locking elements.

Alternating stitching vias energize differential planes, reducing radiated EMI without increasing circuit complexity.

Contoured small diameter vias maintain uniform internal plating thickness across high speed printed circuit boards.

Exposed solder portions at pad corners stabilize alignment during cooling, preventing displacement under vibration.

An asymmetric pressure head prevents heat-induced chip lifting during film on glass bonding while maintaining stable bonding quality.

Laminated multi-layer printed circuit board integrates pneumatic channels and electrical traces, reducing manufacturing costs for thermal stress testing.

Solid phase diffusion bonding via a solder transfer sheet prevents bridging on fine-pitch electrodes by maintaining temperatures below the solder solidus point.

A flexible substrate absorbs resin pressure to prevent device damage and wiring disconnection.

Bending a flexible print circuit board to the substrate backside resolves surface area constraints by routing connections through depth rather than edge traces.

Electroplated platinum bonding replaces corroding solder to maintain mechanical stability and electrical conductivity in saline environments.

Segmented release films with varying widths prevent separation from printed circuit boards, ensuring stable coupling during display module connection.

Vertical PCB inductors reduce conductive layers and footprint, solving high current manufacturing complexity.

Laser-drilled fiducial openings maintain contrast through metal coatings, resolving visibility issues during automated assembly.

Offset soldering pad pairs on a PCB substrate minimize cross-talk between differential signal cables in high-density datacenter racks.

An insulation film covers the active layer of a nano-scale LED device to prevent electrical short-circuits while enabling direct electrode connection.

A bonding apparatus uses a roller and bending member to transport and attach thermal pads from carrier tape.