Liquid Dielectric Casting for Embedded Components
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Solution Overview
Problem
Existing methods for embedding electrical components in printed circuit boards often require pre-routed foils, apply unnecessary forces, and are limited in accommodating components of different sizes and thicknesses, with thickness limitations of less than 20 μm using semiconductor processes like spin coating.
Innovation Solution
A method involving a liquid dielectric layer that is hardened to form a solid dielectric layer around components, eliminating the need for pre-routed foils and allowing for components of varying sizes and thicknesses to be embedded without applying excessive forces, using a carrier with an electrically conductive layer for lamination and structuring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pre-routed foils are used to enclose components, then components can be embedded in the printed circuit board, but the process requires pre-structuring of foils which increases labor and costs
Solution Approach 1:
The invention extracts the dielectric material from pre-structured foil form and uses it as a liquid casting material instead. This eliminates the need for pre-routed foils and their associated pre-structuring steps, directly resolving the technical contradiction by removing the complex preparatory steps while maintaining the embedding function.
Solution Approach 2:
The invention changes the physical state of the dielectric material from solid foil to liquid casting material. This parameter change allows the dielectric to be applied in a fluid state that conforms to component shapes and then hardened, eliminating the need for pre-structured foils and reducing manufacturing complexity.
2Manufacturing precision
If spin coating is used to apply liquid dielectrics, then a planar application is achieved, but thickness is limited to less than 20 μm
Solution Approach 1:
The invention transitions from a static spin coating process that limits thickness to a dynamic casting process where liquid dielectric is poured or injected into cavities. This allows the dielectric to flow and fill the entire cavity volume, then harden in place, enabling thicknesses greater than 20 μm while maintaining application precision.
Solution Approach 2:
The invention uses liquid dielectric casting, which can be assisted by pressure application, to fill cavities with dielectric material. This hydraulic approach allows complete filling of cavity volumes regardless of thickness, overcoming the 20 μm limitation of spin coating while maintaining controlled application.
3Ease of manufacture
If components are pressed into structured foil, then embedding is achieved, but unnecessary forces act on the components
Solution Approach 1:
The invention changes the dielectric material from solid foil to liquid state during the embedding process. This allows components to be positioned in cavities and then have liquid dielectric poured around them, eliminating the need for pressing forces that could damage components. The liquid hardens in place, achieving embedding without mechanical stress.
4Reliability
If multiple dielectric foils are used to enclose thicker components, then complete enclosure is achieved, but the process becomes more complex
Solution Approach 1:
The invention uses a single dielectric material that is cast in a liquid state to fill the entire cavity volume around components. This segmented approach of using one material in a controllable state replaces the multi-foil structure, achieving complete enclosure while simplifying the overall structure and process.
Solution Approach 2:
By changing the dielectric material to liquid state for casting, the invention enables complete enclosure of thicker components in a single step. The liquid flows to fill all spaces and then hardens, replacing the need for multiple layered foils and reducing structural complexity while maintaining reliable enclosure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of compact printed circuit boards with reduced labor and costs, allowing for miniaturization and simultaneous embedding of components of different sizes and thicknesses, with a production format larger than traditional methods, and provides protection from environmental influences.
Implementation Method 1
Cast a liquid dielectric around the at least one component, thereby enclosing the at least one component completely
Implementation Method 2
Harden the liquid dielectric to form a solid dielectric layer
Implementation Method 3
Apply, in particular by lamination thereon, another layer, in particular an electrically conductive layer
Data Source
AI summary
A method for embedding at least one component into a dielectric layer. obtain a good result, it is provided that the method includes the following steps: a) Position and affix the at least one component on a carrier; b) Cast a liquid dielectric around the at least one component, thereby enclosing the at least one component completely; c) Harden the liquid dielectric to form a solid dielectric layer; and d) Apply, in particular by lamination thereon, another layer, in particular an electrically conductive layer. The use of a dielectric layer formed entirely of liquid dielectric, wherein the liquid dielectric is not converted into a solid state until the dielectric is processed.