Transistor Lead Welding via Segmented Busbar Layers
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Solution Overview
Problem
Designing a compact yet powerful inverter that can be manufactured efficiently poses challenges in the geometry of electrical connections to and from transistors, particularly in integrating high-voltage connections and control inputs in a manner that allows for automated and efficient assembly.
Innovation Solution
The method involves positioning transistors with input, output, and control leads extending parallel to each other, using busbar layers to create weld and solder joints for electrical connections, and integrating a circuit board to facilitate both high-voltage and control connections, allowing for the assembly of a laminate busbar structure that enables effective thermal management and efficient manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If transistors are integrated with high-voltage connections and control inputs in a compact arrangement, then the inverter becomes more compact and powerful, but the geometry of electrical connections becomes more complex and difficult to manufacture
Solution Approach 1:
The electrical connections are segmented into distinct functional layers: busbar layers for high-voltage power connections and a circuit board layer for control signal connections. This segmentation allows each layer to be optimized independently for its specific function, simplifying the overall manufacturing process while maintaining compact integration.
Solution Approach 2:
The patent transitions from planar two-dimensional connections to three-dimensional layered connections. By stacking busbar layers and circuit boards in different spatial dimensions, the design achieves compact integration of high-voltage and control connections without increasing the footprint, while maintaining manufacturability through standardized layer stacking.
2Productivity
If automated manufacturing processes are implemented, then production efficiency increases, but precise positioning and alignment of transistor leads with busbar tabs and circuit board openings becomes more challenging
Solution Approach 1:
The busbar layers and circuit board are prepared in advance with pre-positioned tabs and openings that correspond to the transistor lead locations. This preliminary preparation of connection structures allows automated assembly equipment to simply place and connect components without complex real-time alignment operations, maintaining high precision while enabling automation.
Solution Approach 2:
The busbar layers serve as intermediary connection structures between the transistor leads and the final electrical connections. The tabs on the busbars provide standardized connection points that facilitate automated welding or bonding processes, while the circuit board acts as an intermediary for control signal routing, decoupling the precision requirements of power and control connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of a compact, efficient, and thermally managed electronic device with improved electrical connections, facilitating the production of powerful inverters through automated manufacturing processes.
Implementation Method 1
welding the first tab and the one of the input and output leads to each other, and the second tab and the other one of the input and output leads to each other
Implementation Method 2
soldering the control lead and the at least one of the first and second tabs to one or more circuits on the circuit board
Data Source
AI summary
In a method of manufacturing an electronic device a transistor having respective input, output and control leads extending parallel to each other is positioned; first and second busbar layers are placed relative to the transistor so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; the first tab and one of the input and output leads are welded; a circuit board is placed parallel to the busbar layers so that the control lead and the first and second tabs extend through corresponding openings in the circuit board; and the control lead and the at least one of the first and second tabs are soldered to one or more circuits on the circuit board.