Wiring Substrate with Variable Terminal Pitch and Expanded Width
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Solution Overview
Problem
Existing wiring substrates face challenges in ensuring adequate insulation and reducing resistance values while maintaining reliability, especially when dealing with varying voltage differences between terminals, which can lead to increased risk of short circuits and heat generation.
Innovation Solution
A novel wiring substrate design featuring a protective layer covering wiring patterns and terminals, with varying pitches between terminals to accommodate different voltage levels, and expanded width portions on wiring patterns to reduce resistance and allow narrower intervals between adjacent wiring patterns, thereby enhancing insulation and current capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the space between adjacent terminals is increased to ensure insulation safety, then the risk of short circuits is reduced, but the area occupied by the wiring substrate increases
Solution Approach 1:
The patent applies different pitch values between different groups of terminals based on their voltage differences. Specifically, terminals with large voltage differences (first group) are spaced at a first pitch, while terminals with small voltage differences (second group) are spaced at a second pitch that is smaller than the first pitch. This local differentiation allows the substrate area to be reduced while maintaining insulation safety where needed.
Solution Approach 2:
The patent changes the spatial parameter (pitch) between terminals based on the electrical parameter (voltage difference). By adjusting the pitch parameter according to the voltage difference between adjacent terminals, the design achieves optimal balance between insulation safety and area utilization. The pitch is dynamically adjusted rather than using a uniform value throughout the substrate.
2Reliability
If the width of wiring patterns is increased to reduce resistance value, then the current capacity improves, but the interval between adjacent wiring patterns must be increased, reducing the density of the substrate
Solution Approach 1:
The patent applies different pitch values between different groups of terminals based on their voltage differences. Specifically, terminals with large voltage differences (first group) are spaced at a first pitch, while terminals with small voltage differences (second group) are spaced at a second pitch that is smaller than the first pitch. This local differentiation allows the substrate area to be reduced while maintaining insulation safety where needed.
Solution Approach 2:
The patent changes the spatial parameter (pitch) between terminals based on the electrical parameter (voltage difference). By adjusting the pitch parameter according to the voltage difference between adjacent terminals, the design achieves optimal balance between insulation safety and area utilization. The pitch is dynamically adjusted rather than using a uniform value throughout the substrate.
Data Source
AI summary
A wiring substrate includes a plurality of wiring patterns, a protective layer to cover the plurality of wiring patterns and regions between the plurality of wiring patterns, and a plurality of terminals communicating with the plurality of wiring patterns, respectively, the plurality of terminals not covered by the protective layer. Pitch between the plurality of terminals adjacent to each other includes a first pitch and a second pitch wider than the first pitch. At least one of the plurality of wiring patterns, the terminals of which are adjacent to each other at the second pitch, includes a portion of expanded width having a width wider than a width of the plurality of terminals. The portion of expanded width is covered with the protective layer.