Release Film Segmentation for PCB Transfer Stability
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Solution Overview
Problem
Existing technologies face challenges in safely protecting printed circuit boards during transfer and connection to display modules, leading to potential damage and inefficiencies.
Innovation Solution
A release film system comprising a first release film with a fixing portion and a second release film with an incision portion, where the fixing portion extends into the incision portion, providing a stable coupling mechanism to safeguard the printed circuit board during transfer and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a release film is used to protect the printed circuit board during transfer, then the printed circuit board is protected from damage, but the release film may separate from the printed circuit board during the transfer process
Solution Approach 1:
The release film is divided into multiple sections: a first release film portion, a second release film portion, and an intermediate portion connecting them. The intermediate portion has a narrower width than the other portions, creating a segmented structure that prevents complete separation while maintaining protection. This segmentation allows the film to remain attached through the intermediate portion even if other areas separate.
Solution Approach 2:
Different portions of the release film have different widths to serve different functions. The intermediate portion has a narrower width compared to the first and second release film portions. This local variation in width provides both protection (through the broader portions) and prevention of separation (through the narrower intermediate portion that remains attached), creating localized functional zones within the single release film structure.
2Area of stationary object
If the release film is made wider to provide better protection, then the protection coverage is improved, but the release film becomes more prone to separation during transfer
Solution Approach 1:
The release film is divided into multiple sections: a first release film portion, a second release film portion, and an intermediate portion connecting them. The intermediate portion has a narrower width than the other portions, creating a segmented structure that prevents complete separation while maintaining protection. This segmentation allows the film to remain attached through the intermediate portion even if other areas separate.
Solution Approach 2:
Different portions of the release film have different widths to serve different functions. The intermediate portion has a narrower width compared to the first and second release film portions. This local variation in width provides both protection (through the broader portions) and prevention of separation (through the narrower intermediate portion that remains attached), creating localized functional zones within the single release film structure.
3Device complexity
If a single release film is used to protect the printed circuit board, then the structure is simple, but the protection is insufficient during transfer and connection
Solution Approach 1:
The release film is divided into multiple sections: a first release film portion, a second release film portion, and an intermediate portion connecting them. The intermediate portion has a narrower width than the other portions, creating a segmented structure that prevents complete separation while maintaining protection. This segmentation allows the film to remain attached through the intermediate portion even if other areas separate.
Solution Approach 2:
Different portions of the release film have different widths to serve different functions. The intermediate portion has a narrower width compared to the first and second release film portions. This local variation in width provides both protection (through the broader portions) and prevention of separation (through the narrower intermediate portion that remains attached), creating localized functional zones within the single release film structure.
Data Source
AI summary
A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.