CVDD Wires for Semiconductor Die Heat Removal
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Solution Overview
Problem
Semiconductor die in multi-board assemblies face challenges in heat removal due to the inability to place metallic fins directly over the die, leading to potential heat buildup and damage, and existing solutions are costly and ineffective.
Innovation Solution
A method involving Chemical Vapor Deposition Diamond (CVDD)-coated wires and thermally conductive paste is used to effectively remove heat from semiconductor die by attaching CVDD-coated wires to circuit boards at hot-spot locations, with the thermally conductive paste in direct contact with the die, allowing for efficient heat transfer to heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metallic fins are used for heat removal, then thermal transport effectiveness is improved, but the solution becomes inapplicable to multi-board assemblies where fins cannot be placed directly over die
Solution Approach 1:
The patent introduces CVDD-coated wires as intermediary thermal transport elements that can be positioned beneath the die in multi-board assemblies, acting as a mediator to conduct heat away from locations where traditional fins cannot be placed. The wires serve as the intermediate heat conduction path between the die and external heat sinks.
Solution Approach 2:
The patent transitions from surface-mounted metallic fins (two-dimensional placement on board surface) to vertically extending CVDD-coated wires (three-dimensional structure penetrating through the board). This dimensional change allows heat removal in locations where surface placement is not feasible, enabling multi-board assembly compatibility.
2Temperature
If CVDD-coated wires are used for thermal transport, then heat removal effectiveness is improved, but implementation cost increases due to specialized materials and processes
Solution Approach 1:
The patent employs composite construction by coating ordinary wires with CVDD (Chemical Vapor Deposition Diamond) material. This combines the structural simplicity and low cost of standard wires with the exceptional thermal conductivity of diamond, achieving high performance at reduced cost compared to using solid diamond or expensive specialized materials.
Solution Approach 2:
The patent changes the thermal conductivity parameter of ordinary wires by applying a CVDD coating. This material parameter transformation allows standard, low-cost wire substrates to achieve thermal transport properties comparable to expensive specialized thermal management materials, significantly reducing manufacturing costs.
3Temperature
If traditional thermally conductive adhesive is used to attach fins to die, then thermal transport is achieved, but the solution is insufficient for multi-board assemblies and lacks precision in targeting hot-spots
Solution Approach 1:
The patent applies thermal management resources locally by positioning CVDD-coated wires precisely at identified hot-spot locations on the die. Instead of uniform thermal management across the entire die surface, the wires target specific high-heat-generation areas, optimizing thermal transport efficiency and reducing overall die temperature effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective thermal transport, preventing heat buildup and allowing for efficient heat removal in both single and multi-board assemblies, while being cost-effective and suitable for harsh environments.
Implementation Method 1
Because of the high thermal conductivity of the CVDD-coated wire and the thermally conductive paste, and the positioning of the CVDD-coated wire and thermally conductive paste beneath hot-spots, heat is quickly and effectively removed from the die.
Implementation Method 2
Chemical Vapor Deposition Diamond (CVDD) has been used to form sheets of CVDD that are less expensive than natural diamonds.
Data Source
AI summary
A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.