Resin Board Surface Layer for Component Mounting
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Solution Overview
Problem
Existing component mount boards face challenges in maintaining high bonding strength between a sealing resin layer and a resin board when made of different materials, leading to decreased electrical conductivity and reliability due to oxidation and reduced bonding strength when an insulating resist film is used.
Innovation Solution
A component mount board configuration featuring a resin board with a body resin portion and a surface resin layer of the same material, where the conductor pattern is not exposed to the molding resin, and a bonding material fills through holes to prevent oxidation, using liquid crystal polymer and silicon resin materials to enhance bonding strength and electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a sealing resin layer made of different material is formed on the resin board surface, then bonding strength is improved, but electrical conductivity of exposed conductor pattern decreases due to oxidation
Solution Approach 1:
The resin board is segmented into a body resin portion and a surface resin layer. The surface resin layer is made of the same material as the body resin portion, creating a material continuity that prevents oxidation at the interface while maintaining strong bonding with the sealing resin layer.
Solution Approach 2:
The surface resin layer acts as an intermediary between the body resin portion and the sealing resin layer. It provides a material transition zone that ensures both strong bonding and protection against oxidation, eliminating the need for a chemical coupling layer that would compromise electrical conductivity.
2Reliability
If a typical insulating resist film is formed on the resin board surface before sealing resin layer, then electrical conductivity is maintained, but bonding strength decreases
Solution Approach 1:
The resin board is divided into body resin portion and surface resin layer made of the same material. This segmentation eliminates the need for insulating resist film while maintaining both electrical conductivity and bonding strength through material continuity.
Solution Approach 2:
The surface resin layer uses the same material as the body resin portion, creating homogeneity that ensures strong bonding with the sealing resin layer without requiring additional insulating layers, thus maintaining both strength and electrical properties.
3Ease of manufacture
If conductor pattern contacts molding resin, then manufacturing is simplified, but electrical characteristics degrade due to oxidation
Solution Approach 1:
The resin board is segmented with a surface resin layer that protects the conductor pattern from direct contact with molding resin, preventing oxidation while maintaining manufacturing feasibility.
Solution Approach 2:
The surface resin layer serves as an intermediary protective barrier between the conductor pattern and molding resin, preventing harmful contact and oxidation without complicating the manufacturing process.
Data Source
AI summary
A component mount board includes a resin board, an electronic component, and a molding resin. A land conductor is provided in the resin board. The electronic component is mounted on a surface of the resin board, and includes a mounting terminal that is bonded to the land conductor. The resin board includes a body resin portion including the land conductor provided on a surface thereof, and a surface resin layer disposed on a surface of the body resin portion and made of a material of the same type as that of the body resin portion. A conductor is not provided on a surface of the surface resin layer. The surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board. The mounting terminal is bonded to the land conductor via a bonding material filled in the through hole.