Bonding Apparatus Roller and Bending Member for Bubble-Free Thermal Pad Attachment
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Solution Overview
Problem
Conventional bonding methods and apparatuses for attaching heatsink thermal pads to base components in IC packaging processes are not versatile enough to accommodate various base component surfaces, leading to inefficiencies and unsuitable bonding operations.
Innovation Solution
A bonding method and apparatus that utilize a bending member and roller mechanism to transport and attach adhering components from a carrier tape to a base component, ensuring flat and firm attachment without air bubbles, by bending the tape and using a roller to press and scrape the component onto the bonding area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional attaching tip portion or round shaft attaching head is used, then the bonding operation can be performed on simple base components, but it cannot accommodate various base component surfaces with different functions
Solution Approach 1:
The bonding apparatus employs a roller mechanism that can adapt to various base component surfaces through adjustable pressing force and positioning. The roller serves multiple functions: guiding the adhering component, applying uniform pressure during bonding, and accommodating different surface geometries of base components, thereby achieving universality without requiring multiple specialized attaching heads
Solution Approach 2:
The bonding apparatus incorporates adjustable mechanisms that allow dynamic adaptation to different base component surfaces. The pressing force, roller position, and bonding parameters can be adjusted according to the specific requirements of different base components, enabling the same apparatus to handle various functions and surface types effectively
2Manufacturing precision
If the carrier tape is not bent and scraped during rolling, then the bonding process is simpler, but air bubbles are generated and attachment is not flat and firm
Solution Approach 1:
The bending member performs preliminary bending of the carrier tape before the rolling bonding process begins. This preliminary action prepares the tape to follow the contour of the base component surface, ensuring that when the roller applies pressure during bonding, the tape is already positioned correctly to prevent air bubble formation and achieve flat, firm attachment
Solution Approach 2:
The bending member acts as an intermediary element between the carrier tape and the roller. It mediates the interaction by pre-shaping the tape to match the base component geometry, allowing the roller to apply uniform pressure without creating air bubbles or uneven attachment, thus improving bonding quality without requiring the roller itself to perform complex scraping actions
Data Source
AI summary
A bonding method for using a bonding apparatus includes: transporting and reeling a carrier tape which is packaged with an adhering component, on a pressing assembly, and bending the carrier tape through a bending member to be divided into an input section and an output section; driving a roller to indirectly press and abut a front end of the adhering component to bring the adhering component into contact with a bonding start point a base component; and rolling the roller over the carrier tape to attach the adhering component to the bonding area while moving the bending member to indirectly scrape the adhering component from the carrier tape so as to firmly attach the adhering component to the base component without generation of air bubbles.