Bonding Flexible PCB to Camera Module via Ultrasonic and Thermo-Compression
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Solution Overview
Problem
Existing bonding methods for flexible PCBs to camera modules, such as ultrasonic wave and thermo-compression, can cause thermal deformation and damage due to high temperatures and pressures, and do not effectively remove oxide films on connection particles, leading to reduced physical properties and bonding reliability.
Innovation Solution
A device combining ultrasonic wave and thermo-compression bonding processes, where an ultrasonic wave bonding unit removes oxide films on connection particles within a conductive film, and a thermo-compression unit applies heat and pressure to bond the flexible PCB to the camera module, with a controller managing temperature, pressure, and ultrasonic amplitude to enhance bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultrasonic wave or thermo-compression bonding is used to bond flexible PCB to camera module, then bonding can be achieved, but thermal deformation and damage occur due to high temperatures and pressures
Solution Approach 1:
The bonding process is divided into two separate stages: first applying ultrasonic wave to remove oxide films from connection particles, then applying thermo-compression to bond the conductive film. This segmentation allows each process to be optimized independently, removing the need for high temperature and pressure simultaneously, thereby preventing thermal deformation and damage to the camera module while achieving reliable bonding.
2Reliability
If conventional bonding methods are used, then bonding process is simple, but oxide films on connection particles are not effectively removed, reducing physical properties and bonding reliability
Solution Approach 1:
The ultrasonic wave treatment is applied as a preliminary action before thermo-compression bonding. This preliminary action removes oxide films from the connection particles, preparing the surfaces for optimal bonding. By performing this preparation step first, the subsequent bonding process achieves higher reliability without requiring excessive complexity in the bonding parameters themselves.
3Productivity
If high temperature is applied to speed up polymer resin thermo-setting, then bonding operation speed increases, but thermal deformation and damage to camera module occur
Solution Approach 1:
The bonding process is segmented into ultrasonic treatment followed by controlled thermo-compression. The ultrasonic wave removes oxide films at lower temperatures, and the subsequent thermo-compression uses moderate temperature (below melting point of connection particles) sufficient for polymer resin curing. This segmentation enables adequate bonding operation speed without requiring excessive high temperature that would cause thermal deformation and damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows independent control of bonding parameters, effectively removes oxide films without damaging the camera module, increasing the electrical bonding force between electrodes and enhancing the reliability of the bonding process.
Implementation Method 1
an ultrasonic wave bonding unit configured to directly transmit ultrasonic wave vibration energy to the camera module to remove an oxide film on connection particles intrinsically formed inside the conducive film
Implementation Method 2
a thermo-compression unit configured to bond the camera module to the flexible PCB using an conductive film by applying heat and pressure to the conductive film between the camera module and the flexible PCB
Implementation Method 3
an instant frictional heat is generated from an adhesive installed on an adhesive surface of the bonding object. The adhesive is melted by the frictional heat to bond the bonding object
Data Source
AI summary
Disclosed is a device for bonding a flexible PCB (Printed Circuit Board) to a camera module, the device according to an exemplary embodiment of the present disclosure comprising a thermo-compression unit configured to bond the camera module to the flexible PCB using an conductive film by applying heat and pressure to the conductive film between the camera module and the flexible PCB, an ultrasonic wave bonding unit configured to directly transmit ultrasonic wave vibration energy to the camera module to remove an oxide film on connection particles intrinsically formed inside the conducive film, and a controller configured to activate the ultrasonic wave bonding unit when a temperature of the conductive film rises to a predetermined temperature.