Wiring Substrate Segmented Metallic Foils for Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wiring substrates face limitations in miniaturization due to the inability to narrow gaps between wiring conductors, leading to challenges in accommodating the miniaturization of electronic components, and current manufacturing methods are costly and difficult to fine-tune.
Innovation Solution
A wiring substrate with a resin substrate featuring through holes, metallic foils, and plating layers, where the metallic foils are patterned using photolithography and electrolytic plating to form connecting portions and wiring layers with minute gaps, allowing for finer arrangement of wiring layers and improved connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional wiring substrates are used, then manufacturing is simpler, but miniaturization is limited due to inability to narrow gaps between wiring conductors
Solution Approach 1:
The metallic foil is segmented into first and second side metallic foils separated by a border portion, allowing independent positioning and connection to different LED chips. This segmentation enables precise control of gap sizes between wiring conductors while maintaining manufacturing feasibility through modular structure
Solution Approach 2:
The invention transitions from planar wiring arrangement to three-dimensional structure by forming connecting portions that extend through holes in the resin substrate. This vertical dimension allows wiring conductors to be positioned at different heights and locations, enabling miniaturization without increasing manufacturing complexity
2Volume of moving object
If wiring conductors are arranged closer together for miniaturization, then substrate size is reduced, but connection reliability deteriorates
Solution Approach 1:
The connecting portions are nested within holes of the resin substrate, with metallic foils positioned at different levels. This nested structure allows wiring conductors to be closely spaced while maintaining secure mechanical and electrical connections, preventing reliability issues despite miniaturization
Solution Approach 2:
The border portion of the metallic foil is positioned at a specific location between the first and second side metallic foils, creating localized connection points. This local quality approach ensures reliable connections at critical positions while allowing overall substrate miniaturization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the miniaturization of wiring substrates, reduces manufacturing costs, and enhances connection reliability by allowing for precise formation of wiring layers and connecting portions, improving heat radiation efficiency and illuminance.
Implementation Method 1
a first connecting portion formed by a plating film connected to the first side metallic foil inside the first through hole; a second connecting portion formed by a plating film connected to the second side metallic foil inside the second through hole
Implementation Method 2
a first plating layer that is formed on a front surface of the first side metallic foil, a bottom surface of the first connecting portion, and a side surface inside the first slit of the first side metallic foil; and a second plating layer that is formed on a front surface of the second side metallic foil, a bottom surface of the second connecting portion, and a side surface inside the second slit of the second side metallic foil
Data Source
AI summary
A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils.