Stacked PCB IC Assembly with Molding Compound
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Solution Overview
Problem
Conventional integrated circuit (IC) technologies are limited in achieving small form factors, which restricts their application in next-generation devices requiring miniaturization and increased computing power in constrained spaces.
Innovation Solution
The integration of a printed circuit board (PCB) with a die and a molding compound, allowing for the stacking of IC packages using solder joints and enabling a compact solid state drive design that meets or exceeds next-generation form factor targets, such as the M.2 Card Format, by using post-dicing dies and surface-mounted components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional connectors and package-on-package techniques are used to stack PCBs and IC packages, then reliable electrical connections are achieved, but the form factor size is limited and cannot be sufficiently miniaturized
Solution Approach 1:
The patent merges the IC package with the PCB by directly mounting the IC package onto the PCB, eliminating the need for separate conventional connectors and intermediate packaging structures. This integration reduces the overall form factor while maintaining reliable electrical connections through simplified mounting architecture.
Solution Approach 2:
The patent transitions from planar packaging arrangements to three-dimensional stacking architecture, where IC packages are mounted vertically on the PCB. This dimensional change enables significantly reduced form factor by utilizing vertical space rather than horizontal expansion, achieving miniaturization without excessive structural complexity.
2Adaptability or versatility
If traditional packaging methods are used, then component protection is achieved, but design flexibility and thermal management are limited
Solution Approach 1:
The patent segments the packaging structure into modular components including the PCB, IC packages, and protective enclosure, allowing independent optimization of each segment. This enables enhanced design flexibility where each component can be selected and configured independently while maintaining overall system reliability and protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the miniaturization of IC devices, allowing for more powerful computing in smaller form factors, improving performance and enabling applications in wearables and other space-constrained devices, while maintaining high assembly yields and design flexibility.
Implementation Method 1
a molding compound. The molding compound may be in contact with the first face of the first PCB and the second face of the second PCB
Implementation Method 2
the second face of the second PCB is coupled to the first face of the first PCB via one or more solder joints
Data Source
AI summary
Embodiments of integrated circuit (IC) assemblies and related techniques are disclosed herein. For example, in some embodiments, an IC assembly may include a first printed circuit board (PCB) having a first face and an opposing second face; a die electrically coupled to the first face of the first PCB; a second PCB having a first face and an opposing second face, wherein the second face of the second PCB is coupled to the first face of the first PCB via one or more solder joints; and a molding compound. The molding compound may be in contact with the first face of the first PCB and the second face of the second PCB. Other embodiments may be disclosed and/or claimed.