Multi-layer PCB with Integrated Fluidic Channels
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Solution Overview
Problem
Existing devices for testing electronic components under thermal stress require costly manufacturing processes to integrate air, fluidic channels, and electrical circuitry, leading to inefficiencies in thermal management and response times due to separate components for pneumatic and hydraulic systems.
Innovation Solution
A multi-layer printed circuit board assembly with integrated air or fluid channels, ports, and electrical circuits is produced using laminated printed circuit board layers, incorporating sensors and off-the-shelf components, which reduces manufacturing costs and enhances thermal stress testing capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional devices use separate components for pneumatic and hydraulic systems, then the systems can be manufactured, but the manufacturing cost increases and thermal management efficiency decreases
Solution Approach 1:
The patent merges pneumatic channels, hydraulic channels, and electrical circuitry into a single integrated multi-layer printed circuit board assembly. The first through fifth layers are laminated together to form a unified structure where fluid channels and electrical traces coexist and interact, eliminating the need for separate pneumatic and hydraulic components while reducing manufacturing cost and improving thermal management efficiency
2Loss of time
If separate components are used for pneumatic and hydraulic systems, then the device can be assembled, but the response time for thermal stress testing increases
Solution Approach 1:
By integrating fluid channels and electrical circuitry into a single laminated assembly, the patent enables direct coupling between pneumatic/hydraulic systems and electronic components under test. This eliminates the time delays associated with separate component assemblies and allows immediate response in thermal stress testing operations
3Productivity
If integrated air and fluidic channels are added to the printed circuit board, then thermal management is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the fluid delivery system into distinct functional layers: the first layer contains pneumatic channels, the second layer contains hydraulic channels, and subsequent layers contain electrical circuitry and sensor interfaces. This segmentation allows each layer to be optimized for its specific function while maintaining overall integration, improving thermal management without excessive manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables cost-effective integration of pneumatic and fluidic components with electrical connections, allowing for efficient thermal management and reduced response times in thermal stress testing of electronic components.
Implementation Method 1
the use of fluids and/or air for achieving and maintaining the set temperatures points
Implementation Method 2
dual liquid conduction systems
Data Source
AI summary
Method and devices are provided that integrate various internal channels and inlet and outlet ports, configured to operate with air or fluidics, with electrical circuitry. The devices comprise internal channels and outlet/inlet ports that are integrated into multiple layers of printed circuit boards. A multi-layer printed circuit board assembly is produced by laminating the plurality of layers together. The multi-layer printed circuit board assembly can accommodate a variety of off-the-shelf components, as well as electrical circuits and electronic components.