Module Extended Part and Substrate Bypass for Component Density
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Solution Overview
Problem
Existing electronic device mounting structures face challenges in securing an adequate height for modules perpendicularly disposed on substrates, limiting the number of components that can be integrated due to housing size constraints, and existing solutions are not applicable to modules connected via connectors.
Innovation Solution
The proposed solution involves a substrate with a connector and a module featuring an extended part that projects below the terminal, along with a bypass part on the substrate to prevent interference, allowing for increased mounting space and component density without raising the module height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the height of a module perpendicularly disposed on a substrate is increased to secure adequate mounting face height, then the mounting space for components is improved, but the overall size of the electronic device increases
Solution Approach 1:
The module is configured to extend in the height direction (perpendicular to the substrate) rather than only in the planar direction. The extended part projects below the terminal in the installation direction, utilizing the third dimension (height) to provide additional mounting space for components without increasing the device's footprint area.
2Quantity of substance
If the number of modules disposed on a substrate is increased to compensate for inadequate mounting face height, then the component density is improved, but the device complexity and space utilization worsen
Solution Approach 1:
Instead of increasing the number of modules in the planar direction, the invention extends a single module in the height direction. The extended part provides additional mounting space that can accommodate more components vertically, thereby increasing component density without requiring additional modules or increasing device complexity.
3Adaptability or versatility
If the module is extended in the installation direction to increase mounting space, then the component layout flexibility is improved, but the interference with the substrate or other components increases
Solution Approach 1:
A bypass part is provided in the substrate that extracts or removes the interfering portion. The bypass part allows the extended part of the module to pass through or alongside without interfering with the substrate or other components, thereby enabling extended module configuration while avoiding harmful interference.
Solution Approach 2:
The bypass part acts as an intermediary structure between the extended module and the substrate. It mediates the spatial relationship by providing a clearance or passage that allows the extended part to coexist with the substrate without direct interference, enabling both the extended configuration and substrate integrity.
Data Source
AI summary
An electronic device includes a substrate having a connector formed on a main face, and a module having a terminal detachably connected to the connector of the substrate. The module includes an extended part which projects below the terminal in an installation direction. The substrate includes a bypass part which bypasses the extended part when the module is connected to the substrate. The bypass part is a cutout or a recess formed in the substrate. The extended part accommodates a plurality of components aligned in the installation direction. The extended part is extended from the lower end of the module by a difference between a first size, corresponding to multiple times the size of each component, and a second size ranging from the upper end of the module to the end of the terminal.