Angled Beam Test Probe With Mid-Layer Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Test probes used for measuring semiconductor packages face issues of high cost, positional accuracy errors due to overtravel, and scrub characteristics, which can lead to buckling stress and disconnection from the device under test.
Innovation Solution
The test probe design incorporates a mid-layer substrate with angled beams on both sides, constrained laterally to minimize scrub, allowing for controlled deformation and compression, thereby reducing stress and improving positional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the probe is not allowed to translate in the scrub direction, then positional accuracy is improved, but the probe undergoes buckling stress and may yield or fall off the DUT
Solution Approach 1:
The patent employs flexible beams with controlled elasticity to allow Scrub motion while maintaining positional accuracy. The beams are designed with specific material properties and geometric configurations that enable them to flex laterally during contact without undergoing buckling stress, thus resolving the contradiction between limiting scrub for accuracy and allowing scrub for stress relief.
Solution Approach 2:
The patent modifies key parameters including beam length, beam thickness, material modulus, and beam orientation angles to optimize the balance between scrub resistance and stress management. By carefully selecting these parameters, the probe allows controlled Scrub motion that prevents buckling while maintaining measurement accuracy within acceptable tolerances.
2Strength
If overtravel distance is increased to allow for scrub motion, then stress on beams is reduced, but positional accuracy error at the tip increases
Solution Approach 1:
The patent introduces angular orientation of beams relative to the vertical axis, creating a geometric relationship where lateral Scrub motion translates into controlled vertical compression rather than direct horizontal displacement at the tip. This dimensional transformation allows the beam tips to maintain accurate vertical positioning while the beams themselves undergo stress-relieving motion in a different dimensional plane.
3Area of moving object
If probe size is reduced for smaller semiconductor packages, then measurement capability is improved, but manufacturing cost increases prohibitively
Solution Approach 1:
The patent divides the probe structure into modular components including multiple beams, a substrate, and connection elements that can be manufactured separately and assembled. This segmentation enables batch production of smaller probes using standardized components and processes, reducing the prohibitively high costs typically associated with custom-small probe fabrication while maintaining the required miniaturization for small semiconductor packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces scrub and stress on the beams, enhancing the test probe's stability and accuracy, allowing for lower-cost batch production with reduced measurement errors and longer probe lifespan.
Implementation Method 1
the first plurality of beams and the second plurality of beams are configured to deform
Data Source
AI summary
Embodiments herein relate to a test probe. The test probe may have a first plurality of beams and a second plurality of beams. An intermediate substrate may be positioned between the first plurality of beams and the second plurality of beams. In embodiments, both the first and second plurality of beams may be angled. Other embodiments may be described or claimed.