Angled Circuit Board Cross-Sectioning for Void Detection
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Solution Overview
Problem
Existing methods for cross-sectioning circuit boards often miss manufacturing problems due to the perpendicular or parallel nature of traditional slices, which can overlook issues like voids and misregistration of metal layers.
Innovation Solution
The method involves slicing a circuit board at multiple parallel cross-sections that are substantially non-perpendicular and non-parallel to the surface, followed by imaging these slices to generate images for each cross-section, which can then be used to create a three-dimensional image of the circuit board using data interpolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional perpendicular cross-sectional slices are used, then the slicing process is simple and straightforward, but manufacturing problems such as voids and misregistration stripes are missed
Solution Approach 1:
The patent applies dimensionality change by transitioning from traditional perpendicular cross-sectional slices to angled slices that are non-perpendicular and non-parallel to the board surface. This angular orientation enables the slice to intersect with manufacturing defects such as voids and misregistration stripes that are parallel to the board surface, thereby improving detection precision while maintaining a relatively simple slicing process
2Measurement precision
If multiple angled cross-sectional slices are taken, then manufacturing defects are detected more accurately, but the complexity of the slicing process increases
Solution Approach 1:
The patent applies segmentation by dividing the circuit board inspection into multiple parallel cross-sectional slices taken at different positions along the board. Each slice is oriented at an angle that is non-perpendicular and non-parallel to the board surface. This segmentation approach allows systematic coverage of the board interior while maintaining consistent angular orientation, improving defect detection without requiring overly complex slicing operations
Data Source
AI summary
A method may include slicing a circuit board at multiple parallel cross-sections of the circuit board, each slice of the circuit board taken in a respective slice plane substantially non-perpendicular and substantially non-parallel to a surface of the circuit board.