Angled Device Bay Card Assembly Thermal Management
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Solution Overview
Problem
Computing systems face inefficiencies in heat management due to electrical inefficiencies, which affect air flow and component temperatures, particularly when oriented in certain positions that block airflow or impede heat transfer.
Innovation Solution
A card assembly design with device bays angled between 25 degrees to 75 degrees relative to the edge connector, allowing for efficient air flow and heat transfer without the need for repeaters or redrivers, and accommodating various device lengths, including M.2 specification devices, to optimize signal trace lengths and reduce heat-related issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If device bays are positioned at angles between 25 to 75 degrees relative to the edge connector, then air flow and heat transfer efficiency are improved, but device bay configuration complexity increases
Solution Approach 1:
The patent applies parameter changes by optimizing the angular orientation of device bays relative to the edge connector. By setting the angle between 25 to 75 degrees, the design improves air flow patterns and heat transfer efficiency while maintaining manufacturing feasibility. This parameter optimization resolves the contradiction by achieving better thermal management without excessive complexity.
Solution Approach 2:
The patent introduces a dimensional change by orienting device bays at angles rather than using conventional parallel or perpendicular arrangements. This angular orientation creates more effective air flow paths and heat dissipation patterns, improving thermal management while the standardized angle ranges keep the configuration manageable.
2Productivity
If angled device bays are used to improve air flow, then heat transfer efficiency increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies angular parameters between 25 to 75 degrees, which provides sufficient manufacturing precision while achieving effective air flow and heat transfer. This parameter range balances performance improvement with manufacturing feasibility, avoiding the need for extremely tight tolerances that would complicate production.
3Adaptability or versatility
If device bays are positioned to accommodate various device lengths, then adaptability increases, but air flow path length increases
Solution Approach 1:
The patent uses angular orientation to accommodate devices of various lengths efficiently. By positioning device bays at angles between 25 to 75 degrees, the design creates flexible space utilization that can accommodate different device dimensions while maintaining relatively short and efficient air flow paths for heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The angled device bays enhance air flow and heat transfer, maintaining component temperatures within operational ranges without additional circuitry, thus improving overall system efficiency and reducing costs and power consumption.
Implementation Method 1
The angled device bays enhance air flow and heat transfer, maintaining component temperatures within operational ranges
Implementation Method 2
The angled device bays enhance air flow and heat transfer, maintaining component temperatures within operational ranges
Data Source
AI summary
A card assembly includes a card that includes a first edge and an opposing second edge, where the first edge includes an edge connector; and device sockets mounted to the card and operatively coupled to the edge connector, where each of the device sockets defines an end of a respective device bay, where each of the device bays is disposed at an angle of approximately 25 degrees to approximately 75 degrees with respect to the edge connector.