Digital Processing Power Distribution TRIZ Cases
- Vented Slot-Filler Tray With Airflow Partitioning and EMI Shielding
Partition panels extend a vented rack blanking tray into the slot to baffle cooling air while a conductive layer maintains EMI containment.
- Insulated Computing Unit Housing With Vehicle AC Cooling
Vehicle AC-fed cooling and insulated polymethacrylimide walls keep a housed computing unit within a safe temperature range and limit vibration.
- Modular In-Vehicle Compute Platform for ECU Consolidation
Standardized compute modules and connectors cut ECU redesign and reprogramming, enabling scalable in-vehicle updates across domains.
- Chip-on-Film Package Structure for Flexible Bending and Panel Retention
Different-modulus insulating layers reinforce and flex a COF package, enabling thinner films without increasing display panel detachment risk.
- Chip-on-Film Package Structure for Narrow Bezel Bending
Different-modulus insulating layers reinforce and bend a COF film, cutting bezel length while reducing panel detachment risk.
- Terminal Input Mapping for Electronic Mounting Position Registration
Input-state combinations at multiple terminals identify and register mounting positions, reducing part variation and registration effort.