Modular Expansion Board Assembly for Compact Industrial I/O

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Solution Overview

Problem

Existing industrial computers face limitations in accommodating varying input/output interface demands due to spatial constraints on the motherboard, leading to increased motherboard size and impractical dimensions.

Innovation Solution

An electronic device assembly design that includes a host with a first housing and a second housing, featuring an adapter circuit board and function expansion modules, allowing for electrical connections through connectors and slide rails, enabling functionality expansion without enlarging the motherboard dimensions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the quantity of input/output interfaces is increased to meet diverse industrial demands, then the functionality and adaptability are improved, but the motherboard size increases resulting in impractical dimensions

Engineering Contradiction:
Improvefunctionality expansionVSAvoidmotherboard size
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent divides the interface expansion functionality into separate adapter circuit boards that can be independently added to the motherboard. Each adapter board provides specific I/O interfaces without requiring the entire motherboard to be enlarged, thus segmenting the interface provision from the main motherboard structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent utilizes the height dimension by stacking adapter circuit boards vertically on the motherboard surface. This allows multiple I/O interfaces to be added without increasing the motherboard's planar area, effectively transitioning from two-dimensional expansion to three-dimensional arrangement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If the motherboard size is increased to accommodate more input/output interfaces, then the interface quantity is improved, but the device becomes less practical for application

Engineering Contradiction:
Improveinterface quantityVSAvoidpractical applicability
Core Design Contradiction:
Quantity of substanceVSEase of operation

Solution Approach 1:

The interface expansion is achieved through separate, modular adapter boards rather than enlarging the main motherboard. This segmentation allows the motherboard to remain compact and practical while still providing numerous I/O interfaces through add-on modules.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The adapter circuit boards serve as universal interface providers that can be configured with different types of I/O interfaces based on specific industrial requirements. This multi-functionality allows a single compact motherboard to support diverse interface needs without physical enlargement.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If adapter circuit boards are added to expand functionality, then the adaptability is improved, but the device complexity increases

Engineering Contradiction:
Improvefunctionality expansionVSAvoidassembly structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The adapter circuit boards are designed to be dynamically addable and removable from the motherboard, allowing the system configuration to be adjusted based on specific needs. This dynamic modularity enables functionality expansion without permanently complicating the base device structure.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The adapter circuit boards act as intermediary components between the motherboard and various I/O devices. These intermediaries provide standardized connection interfaces that simplify the overall system integration, reducing complexity by creating uniform interface layers.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20260050302A1Electronic device assembly
Publication Date: 2026.02.19 ASROCK IND COMPUTER CORP
  • US20260050302A1 patent drawing
  • US20260050302A1 patent drawing
  • US20260050302A1 patent drawing

AI summary

An electronic device assembly including a host, a second housing, a first adapter circuit board and a first function expansion module is provided. The host includes a first housing and a motherboard disposed in the first housing. The second housing assembled on one side of the first housing has a base. The first adapter circuit board is disposed on the base and is electrically connected to the motherboard. The first function expansion module is disposed on the host, wherein the first function expansion module is electrically connected to the first adapter circuit board. The first function expansion module includes a first frame and a function expansion board. The first frame has a pair of first sub-brackets facing each other. The first sub-brackets have slide rails facing each other, and the function expansion board has a sliding board suitable for moving along the slide rails.