Angled EMC Shield Structure for PCB-Housing Contact

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Solution Overview

Problem

Existing EMC shields do not adequately meet regulatory specifications and are not well suited for interfacing with printed circuit boards (PCBs) and housings, failing to provide effective electromagnetic compatibility (EMC) and often compromising heat transfer and vibration management.

Innovation Solution

An EMC shield design featuring angled portions with a bend portion connecting them, allowing for improved contact and spring properties, which is manufactured from stamped and bent sheet metal, and optionally using compressible pads for attachment to the housing, enhancing EMC shielding, thermal conductivity, and vibration absorption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a straight EMC shield is used, then the manufacturing is simpler, but it cannot compensate manufacturing tolerances and does not provide advantageous contact between the shield and housing

Engineering Contradiction:
Improvecontact quality between shield and housingVSAvoidshield structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The shield incorporates a bend portion with a curved transition between the first and second portions. This curvature allows the shield to adapt to manufacturing tolerances and achieve planar contact with the housing, resolving the contradiction between contact quality and structural simplicity.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The bend portion provides spring properties to the shield, enabling it to dynamically adjust to manufacturing variations and maintain optimal contact with the housing. This dynamic capability improves contact quality without requiring complex adjustment mechanisms.

Inventive Principle:
Principle #15Dynamics

2Area of stationary object

If the first and second portions are arranged in a single plane, then the structure is simpler, but it cannot provide advantageous contact area with the housing

Engineering Contradiction:
Improvecontact area between shield and housingVSAvoidshield geometric complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The shield transitions from a single-plane arrangement to a three-dimensional configuration with the bend portion. This dimensional change enables the second portion to be attached to the housing at an angle different from perpendicular, increasing the contact area while maintaining structural integrity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If the second portion is attached perpendicularly to the housing, then the attachment is straightforward, but it reduces the contact area and spring properties

Engineering Contradiction:
Improvecontact area between shield and housingVSAvoidattachment complexity
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The bend portion is designed to provide spring properties that enable the second portion to attach to the housing at an angled orientation. This dynamic attachment mechanism increases contact area while remaining manufacturable through standard bending and attachment processes.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design compensates for manufacturing tolerances, ensures effective EMC shielding, facilitates heat transfer, and absorbs vibrations, while providing a stable interface between the PCB and housing.

Implementation Method 1

the use of the bend portion may advantageously enable spring properties of the EMC shield (e.g., the second portion, and preferably the third portion) which may be advantageous for assembling/closing the housing

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

Shielding aims at improving EMC properties for electrical components. It may be generally used with any electrical component having high exposure to and/or high emissions of electromagnetic radiation

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 3

enhancing EMC shielding, thermal conductivity, and vibration absorption

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

enhancing EMC shielding, thermal conductivity, and vibration absorption

Methodology Applied
Scientific EffectVibration damping: Damping

Data Source

PatentUS20250287555A1EMC Shielding Design to Meet EMC Requirements/Specifications
Publication Date: 2025.09.11 APTIV TECHNOLOGIES AG
  • US20250287555A1 patent drawing
  • US20250287555A1 patent drawing
  • US20250287555A1 patent drawing

AI summary

An electromagnetic compatibility (EMC) shield for providing electromagnetic compatibility of electronic components. The EMC shield includes a first portion, a second portion, and a third portion. The first portion being arranged for attachment to a printed circuit board. The second portion being arranged for attachment to a housing at least partially enclosing the printed circuit board. The first and second portions are arranged at an angle to each other. The third portion connects the first and second portions. The third portion is a bend portion between the first portion and the second portion.