Magnetic/Electric Field Screening TRIZ Cases
- Polymer Nanoparticle EMI Shields for Lightweight High-Frequency Attenuation
Magnetic and conductive nanoparticles in a polymer matrix cut shield weight while maintaining strong high-frequency EMI attenuation.
- Display Control Unit Shielding Strips for Heat Dissipation
Spaced shielding strips maintain electric field shielding between display circuits while opening heat paths that extend control unit lifespan.
- Optical Sensor EMI Shield Structure for Crosstalk and Leakage Control
A localized EMI shield with an aligned aperture and lens isolates optical sensor emitters, reducing leakage, crosstalk, footprint, and assembly cost.
- Heat Dissipation Structure for Stable Thermal Interface Contact
An adhesive-backed thermal interface structure keeps the heat sink in close contact, lowering thermal resistance and preventing detachment.
- Camera Connector Shielding Structure for EMI-Stable Shooting
A grounded shielding frame and cover suppress EMI at camera connection terminals, preventing shooting artifacts and signal freezing.
- Flavor Inhaler Housing Layout for Heat Diffusion and Signal Transmission
A segmented housing keeps metal over the atomizing unit for heat diffusion while leaving the communication unit uncovered for stable external links.
- Embedded Conductive Screen in Optical Windows to Prevent Delamination
Melting the substrate surface around a conductive screen embeds it in transparent material, preventing EMI mesh delamination during encapsulation.
- Conductive ECU Housing With Comb Partitions for EMI Shielding
Comb-shaped conductive housing partitions shrink connector openings to block EMI, cut resonance, and reduce communication errors at lower cost.
- Multilayer EMI Shield Cover for Heat Dissipation and Low Weight
A layered conductive and nonconductive shield cuts EMI and EMR leakage while improving heat dissipation and keeping electronic assemblies lightweight.
- Shield Can Injection Cover for Heat Transfer Material Containment
A bendable injection cover and partitioned shield can contain heat transfer material without adding protrusion, helping maintain device thickness.
- Sealed Dual-Chamber Display Cooling With Dust Isolation
A sealed dual-chamber layout cools the display module and main board while blocking dust and moisture behind the cover plate.
- Optical Port Shielding Structure for EMC and Fastening Reliability
A segmented fastener and EM-absorbing piece improve optical module shielding, fastening stability, and vibration resistance.
- Lighting Fixture Control Module With External Dipole Antenna
External dipole antenna placement and detector shielding improve occupancy sensing while limiting wireless interference in lighting fixtures.
- TOF Sensor Shielding Structure for High-Power EMI Control
Nested grounded shield cans contain EMI from high-power TOF sensing, protecting nearby circuits and internal antenna performance.
- COF Chip Protection and EMI Shielding for Display Panel Edges
An integrated resin protection layer and shielding layer simplify COF edge-chip protection while maintaining physical and electromagnetic coverage.
- Optical Transceiver Module Layout With EMI Shielding and Folded Paths
EMI shielding between transmitter and receiver assemblies plus folded optical paths cuts crosstalk, saves space, and supports higher bandwidth.
- Multilayer Molded Parts for Low-Reflection Microwave Attenuation
A two-layer polymer-carbon structure balances microwave absorption and low reflection, improving radar signal attenuation and sensor accuracy.
- Shielding Cover Reinforcement for Dense PCB Component Layouts
A reinforcing section above a stepped component prevents shielding cover collapse while preserving tight PCB spacing and reliability.