Heat Dissipation Structure for Stable Thermal Interface Contact
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Solution Overview
Problem
Heat generated by electronic components in devices like PCs and mobile phones is not effectively dissipated, leading to thermal damage and performance throttling due to gaps and low thermal conductivity at contact surfaces between heat sinks and components.
Innovation Solution
A heat dissipation structure with a support member, thermal interface material, and adhesive member to ensure close contact and prevent detachment, using a carbon-containing heat conductive fiber for improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal interface material is used to fill the gap between the heat sink and electronic component, then thermal resistance is reduced, but the thermal interface material may detach from the heat sink over time
Solution Approach 1:
The adhesive member is applied in advance to the heat sink surface before placing the thermal interface material. This preliminary application ensures that the thermal interface material is securely bonded to the heat sink from the beginning, preventing detachment during operation while maintaining good thermal contact.
2Manufacturing precision
If the heat dissipation member is pressed to improve contact, then close contact property is improved, but the thermal interface material may be compressed unevenly
Solution Approach 1:
The adhesive member is applied selectively to specific regions of the heat sink where contact is needed, rather than uniformly across the entire surface. This localized application allows the thermal interface material to be pressed into close contact with the heat sink in critical areas while maintaining its structural integrity and uniform distribution properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation by maintaining close contact between the heat sink and thermal interface material, preventing detachment and reducing thermal resistance, thus preventing thermal damage and improving component performance.
Implementation Method 1
a thermal interface material disposed between the heat dissipation surface of the heating source and the bottom surface of the heat dissipation member
Implementation Method 2
an adhesive member disposed in the area in which the thermal interface material is supported by the support member between the thermal interface material and the heat dissipation member, the adhesive member bonds the thermal interface material and the heat dissipation member to each other
Implementation Method 3
The adhesive member may press an area of the heat dissipation member in which the thermal interface material is supported by the support member, and the thermal interface material may be compressively deformed in the area in which the adhesive member is disposed to come into close contact with an area of the heat dissipation member facing the heat dissipation surface
Data Source
AI summary
An electronic device is provided. The electronic device includes a heat generation source including a heat dissipation surface dissipating heat, a support member disposed on a lateral side of the heat dissipation surface and surrounding at least a part of the heat generation source, a heat dissipation member facing the heat dissipation surface of the heat generation source and disposed so as to cover an area in which the support member is disposed, a thermal interface material disposed between the upper part of the heat dissipation surface of a heat generation surface and the lower surface of the heat generation source, and supported by the support member, and an adhesive member disposed in the area in which the thermal interface material is supported by the support member between the thermal interface material and the heat dissipation member, and for coupling the thermal interface material and the heat dissipation member.