Shield Can Injection Cover for Heat Transfer Material Containment

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Solution Overview

Problem

Heat transfer material discharged through openings in shield cans of electronic devices leads to unintended discharge, increasing device thickness and reducing available space, and existing cover members require additional space, exacerbating the issue.

Innovation Solution

A shield can with a partition wall portion facing the opening to block heat transfer material flow, adjustable composition ratio for flow control, and a bendable cover member for injection without protrusion, minimizing space usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a cover member is disposed in the shield can to prevent heat transfer material from flowing back into the injection hole, then the heat transfer material can be contained, but the electronic device requires additional space and the thickness increases

Engineering Contradiction:

Improveheat transfer material containmentVSAvoiddevice thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The cover member is designed as a thin, flexible component that can be inserted into the injection hole to seal it. This thin-film approach provides the necessary containment function while minimizing the space required, thus reducing the impact on device thickness compared to rigid cover structures.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The cover member is nested within the shield can structure, specifically positioned at the injection hole location. This nesting approach allows the cover member to utilize the existing space within the shield can without requiring additional external space, thereby minimizing the increase in device thickness.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Ease of operation

If an opening is formed in the shield can to allow circuits to pass through, then circuit connectivity is enabled, but heat transfer material may be discharged outside the shield can through the opening

Engineering Contradiction:

Improvecircuit connectivityVSAvoidheat transfer material containment

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The shield can structure is segmented with a specific opening location that is separated from the heat transfer material storage area. The opening is positioned and sized to allow circuit passage while the cover member seals the injection hole, creating functional segmentation that enables both circuit connectivity and heat transfer material containment.

Inventive Principle:

Principle #1Segmentation

3Reliability

If the shield can is designed to cover the electronic component, then electromagnetic shielding and heat dispersion are achieved, but space for heat transfer material injection is reduced

Engineering Contradiction:

Improveelectromagnetic shieldingVSAvoidinjection space

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The injection hole is pre-formed in the shield can structure during manufacturing, allowing for subsequent heat transfer material injection without requiring additional space or modification of the shield can geometry. This preliminary action enables the shield can to maintain its electromagnetic shielding function while providing a dedicated injection pathway.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents unintended discharge of heat transfer material, maintains device thickness, and optimizes space utilization by adjusting material flow and cover member design.

Implementation Method 1

A liquid heat transfer material for conducting heat generated by the electronic component to the surrounding area thereof may be filled inside the shield can

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the cover member is bendable for insertion of an external object for injecting the heat transfer material inside the shield can through the injection hole

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS20250365907A1Electronic device including shield can

Publication Date: 2025.11.27 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device is provided. The electronic device includes a printed circuit board, an electronic component disposed on the printed circuit board, a shield can including a planar portion having a seating portion formed as a groove including an injection hole, and a side portion which extending from the planar portion, the shield can being coupled to the printed circuit board to cover the electronic component, a cover member disposed in the seating portion of the shield can, and a heat transfer material filled inside the shield can, wherein the cover member is bendable for insertion of an external object for injecting the heat transfer material inside the shield can through the injection hole.