COF Chip Protection and EMI Shielding for Display Panel Edges
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Solution Overview
Problem
Existing display devices, such as organic EL and liquid crystal displays, require separate steps for attaching IC protective tapes and metal tapes after mounting a chip-on-film (COF) at the panel edge, which complicates physical and electromagnetic protection of the IC chip.
Innovation Solution
A display device with a film substrate that integrates a chip protection layer and an electromagnetic shielding layer, formed from a curable resin thicker than the IC chip, is used to cover and protect the IC chip, with a cured portion surrounding it and an uncured portion elsewhere, allowing for easy physical and electromagnetic protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate attachment steps are used for IC protective tape and metal tape, then physical and electromagnetic protection is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the IC protective tape and metal tape into a single integrated protective structure where the metal tape is directly attached to the back surface of the IC chip, eliminating the need for separate attachment steps while maintaining both physical and electromagnetic protection functions
Solution Approach 2:
The metal tape serves multiple functions simultaneously: it provides electromagnetic shielding, acts as a structural protective layer, and serves as the attachment surface for the IC chip, replacing what would traditionally require multiple separate components and steps
2Reliability
If multiple separate tape attachment steps are performed, then comprehensive protection is achieved, but production time increases
Solution Approach 1:
The patent merges the protective functions into a single attachment operation where the metal tape is attached directly to the IC chip back surface in one step, significantly reducing production time while maintaining comprehensive protection
Solution Approach 2:
The metal tape is pre-positioned and prepared for direct attachment to the IC chip back surface before the chip is mounted on the FPC, allowing the protective structure to be in place before final assembly steps
3Strength
If IC protective tape is attached in U-shape to surround IC chip, then physical protection is improved, but alignment precision requirements increase
Solution Approach 1:
The patent extracts the complex U-shaped attachment requirement from the protective structure and replaces it with a simpler direct attachment of the metal tape to the IC chip back surface, eliminating the need for precise U-shaped alignment while maintaining protective effectiveness
Solution Approach 2:
Instead of attaching protective materials around the IC chip from the outside (U-shaped configuration), the patent inverts the approach by attaching the metal tape directly to the back surface of the IC chip, simplifying the alignment requirement to a straightforward surface attachment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated protection layer effectively safeguards the IC chip with reduced complexity by simplifying the attachment process and ensuring comprehensive protection.
Implementation Method 1
a chip protection layer which is formed by applying a curable resin on a back surface of a radio wave shielding sheet
Implementation Method 2
a cured portion of the curable resin provided to surround the integrated circuit chip or cover the integrated circuit chip in a plan view
Implementation Method 3
an electromagnetic shielding layer which is layered on the chip protection layer integrally provided to cover the integrated circuit chip
Data Source
AI summary
A display device includes: a display panel; and a film substrate which is mounted at an edge portion of the display panel and on which an integrated circuit chip is mounted. The display device includes, on the film substrate, a chip protection layer and an electromagnetic shielding layer layered on the chip protection layer integrally provided to cover the integrated circuit chip and a peripheral portion of the integrated circuit chip. A thickness of the chip protection layer is greater than a thickness of the integrated circuit chip, and the chip protection layer is formed of a curable resin, and includes a cured portion of the curable resin provided to surround the integrated circuit chip or cover the integrated circuit chip in a plan view, and an uncured portion of the curable resin provided in a part other than the cured portion.