Shielding Cover Reinforcement for Dense PCB Component Layouts
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Solution Overview
Problem
Shielding cases for electronic devices with densely packed components face stability and reliability issues due to collapse in compact spaces, leading to deformation and increased layout area, which affects performance and space utilization.
Innovation Solution
A reinforcing part is integrated into the shielding case design, specifically located opposite a step surface of stacked components, enhancing the case's strength and stability while maintaining compact component arrangement, using a support bracket and cover plate to enclose a shielded region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shielding case is installed on a circuit board with densely distributed elements, then electromagnetic shielding is achieved, but the case body is prone to collapse in compact spaces
Solution Approach 1:
The case body is divided into multiple regions: a first region with a first thickness and a second region with a second thickness greater than the first thickness. This segmentation allows the case body to have enhanced strength in specific areas while maintaining overall compactness and shielding effectiveness.
Solution Approach 2:
The case body features non-uniform thickness distribution, with the second region having greater thickness than the first region. This local quality enhancement provides additional structural support in areas prone to collapse while preserving space in other regions.
2Strength
If the case body thickness is increased to prevent collapse, then strength is improved, but layout space on the circuit board is reduced
Solution Approach 1:
The case body features non-uniform thickness distribution, with the second region having greater thickness than the first region. This local quality enhancement provides additional structural support in areas prone to collapse while preserving space in other regions.
Solution Approach 2:
Instead of uniformly increasing thickness in the vertical dimension throughout, the invention selectively increases thickness only in the second region, utilizing the vertical dimension strategically to provide support where needed without compromising horizontal layout space.
3Ease of manufacture
If uniform thickness is used for the case body, then manufacturing is simplified, but the case body collapses in compact spaces
Solution Approach 1:
The case body features non-uniform thickness distribution, with the second region having greater thickness than the first region. This local quality enhancement provides additional structural support in areas prone to collapse while preserving space in other regions.
Data Source
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AI summary
This application provides a shielding case, a circuit board assembly, and an electronic device, where the shielding case includes a case body, the case body and the circuit board enclose a shielded region, and at least part of elements on the circuit board are capped inside the shielding case. The elements located inside the case body include a first component, where the first component has a step surface facing the case body. A reinforcing part is provided in a region on the case body corresponding to the step surface of the first component, where at least partial structure of the reinforcing part is located in a region on the case body directly opposite the step surface, so that a space formed above the step surface of the first component can be utilized. The reinforcing part is added to increase strength of the case body, preventing a region on the case body around a site corresponding to the step surface from collapsing, and improving stability and reliability of the shielding case. In addition, a gap between the first component and an adjacent element remains unchanged or has a smaller increase, so that a layout structure with dense arrangement is kept on the circuit board, saving element layout area of the circuit board, and improving space utilization of the circuit board.