Embedded Conductive Screen in Optical Windows to Prevent Delamination
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Solution Overview
Problem
Current methods of attaching electromagnetic interference (EMI) meshes to optically transparent materials result in partial delamination during encapsulation.
Innovation Solution
A method involving placing a conductive screen on a substrate and melting a surface portion of the substrate to embed the screen into it, using techniques like Joule heating, microwave heating, or laser heating, ensuring the screen integrates seamlessly with the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current methods of attaching EMI meshes to optically transparent materials are used, then the mesh can be attached to the substrate, but partial delamination occurs during encapsulation
Solution Approach 1:
The patent merges the EMI mesh with the substrate by embedding the mesh into a molten polymer matrix. The conductive mesh is placed on the substrate, then the substrate is heated to melt the polymer, which then flows and encapsulates the mesh, creating a unified structure where the mesh and substrate become integral to each other, eliminating delamination risks
Solution Approach 2:
The patent utilizes parameter changes in the polymer material by heating it to its melting point. The polymer transitions from a solid state to a molten state, allowing the mesh to be embedded, then cools and solidifies again, locking the mesh in place. This phase transition enables reliable attachment without delamination
2Manufacturing precision
If the substrate is melted to embed the screen, then the screen integrates seamlessly with the substrate, but the substrate undergoes phase change
Solution Approach 1:
The patent employs phase transition of the polymer substrate from solid to liquid (melting) to enable embedding of the conductive mesh, then back to solid upon cooling. This phase change allows the substrate to be temporarily softened for mesh integration, then hardens to provide seamless, precise integration of the mesh into the substrate structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents delamination and ensures a robust integration of the EMI screen within the substrate, enabling applications such as optical windows, touch screens, and windows with heating elements.
Implementation Method 1
The heating the screen includes Joule heating by passing an electrical current through the screen
Implementation Method 2
The heating the screen includes microwave heating of the screen
Implementation Method 3
The heating the screen includes laser heating of at least part of the screen
Implementation Method 4
melting a surface portion of the substrate, thereby allowing at least part of the screen to sink into and embed into the substrate
Data Source
AI summary
A method of embedding a screen in a substrate includes placing the screen on the substrate, and then melting part of the substrate, so that the screen becomes embedded in the substrate. The melting may involve heating at least part of the screen to melt part of the substrate, or directly heating the part of the substrate. The screen may be a screen of electrically-conductive material, and the heating may be Joule heating in which an electrical current is passed through the screen to heat the screen. Alternatively, the heating may involve microwave, conductive, or laser heating. The produced device of the substrate with an embedded screen may be an optical window with an embedded electromagnetic interference (EMI) screen, may be a touch screen or touch display, or may be a window with an embedded heating element, to give a few non-limiting examples.