Angled EMC Shield Design for Manufacturing Tolerance Compensation
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Solution Overview
Problem
Existing EMC shields do not adequately meet regulatory specifications and are not well suited for interfacing with printed circuit boards and housings, leading to potential interference and compliance issues, while also lacking in heat transfer and vibration management.
Innovation Solution
An EMC shield design featuring angled portions and a bend portion to compensate for manufacturing tolerances, providing enhanced contact and spring properties, along with integrally formed sheet metal construction for improved assembly and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a straight EMC shield is used, then the structure is simple and manufacturing is easy, but manufacturing tolerances cannot be compensated and contact area with housing is reduced
Solution Approach 1:
The EMC shield incorporates a bend portion with a specified bending radius (at least 0.5 mm, preferably 1.0-3.0 mm) that replaces a straight configuration. This curvature enables the shield to compensate for manufacturing tolerances in height and angular positioning while maintaining structural integrity and achieving planar contact with the housing.
Solution Approach 2:
The shield transitions from a two-dimensional planar structure to a three-dimensional form with angled portions and bend sections. The first portion is arranged substantially perpendicular to the PCB, the second portion is attached at an angle to the housing, and the bend portion connects them at an angle excluding substantially 0 degrees, creating multi-dimensional geometry that compensates for tolerances.
2Reliability
If the EMC shield is made rigid for structural stability, then positioning is precise, but spring properties for assembly and vibration compensation are lost
Solution Approach 1:
The shield incorporates spring properties through its bent configuration, allowing it to deform elastically during assembly and under vibration. The bend portion with radius at least 0.5 mm provides flexible compliance while maintaining positional stability, enabling the shield to adapt to housing variations and absorb mechanical stresses.
Solution Approach 2:
The shield's geometric parameters are optimized to provide both rigidity and flexibility. The bending radius is controlled within specific ranges (0.5-3.0 mm) to achieve the desired balance between structural stability and spring properties, allowing the shield to maintain positioning while facilitating easy assembly and vibration compensation.
3Area of stationary object
If a single-plane shield design is used, then manufacturing is simple, but contact area with PCB and housing is insufficient
Solution Approach 1:
The shield employs a multi-planar configuration where the first portion is substantially perpendicular to the PCB and the second portion is attached at an angle to the housing. This three-dimensional arrangement maximizes the contact area with both the PCB and housing surfaces, improving electrical, thermal, and mechanical coupling.
Solution Approach 2:
The bend portion with controlled radius creates a smooth transition between the first and second portions, distributing contact forces and maximizing the effective contact area. The curved geometry ensures planar contact rather than edge contact, enhancing the shield's interface with surrounding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures effective electromagnetic compatibility, compensates for manufacturing tolerances, enhances heat transfer, and manages vibrations, while facilitating easy assembly and compliance with regulatory specifications.
Implementation Method 1
the use of the bend portion may advantageously enable spring properties of the EMC shield (e.g., the second portion, and preferably the third portion) which may be advantageous for assembling/closing the housing
Implementation Method 2
the disclosed subject matter may also enhance heat transfer between mechanical and electronic elements
Data Source
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AI summary
The present disclosure relates to electromagnetic compatibility (EMC) and other purposes related to flow of electric current, heat transfer, vibration transmission or other mechanical activities. An EMC shield (100) for providing electromagnetic compatibility of electronic components is provided. The EMC shield (100) comprises a first portion (102), the first portion (102) being arranged for being attached to a printed circuit board. The EMC shield (100) further comprises a second portion (110), the second portion (110) being arranged for being attached to a housing at least partially enclosing the printed circuit board. The first and second portions (102, 110) are arranged at an angle to each other. The EMC shield (100) further comprises a third portion (112) connecting the first and second portions (102, 110), and wherein the third portion (112) is a bend portion between the first portion (102) and the second portion (110).