Angled End Effector for High-Temperature Substrate Transfer
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Solution Overview
Problem
Existing end effectors for semiconductor substrates suffer from drooping due to natural material compliance and weight, especially at high temperatures, which can lead to deformation and misalignment during transfer in densely packed environments and high-temperature processes.
Innovation Solution
The end effector is designed with a predetermined angled mounting and a slope to counteract drooping, and is secured to a robot arm with a clamp to allow for thermal expansion, ensuring precise alignment and stability at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the end effector is made thinner to access densely packed substrates, then accessibility is improved, but droop increases due to reduced structural rigidity
Solution Approach 1:
The end effector is pre-mounted at an angled orientation (e.g., 5-15 degrees) relative to the robot arm axis before substrate loading. This preliminary angular configuration creates a geometric relationship where the end effector's natural droop under substrate weight compensates for the initial angle, allowing the effector to return to a horizontal position when loaded, thus eliminating droop without requiring thicker construction
2Manufacturing precision
If the end effector is tightly secured to the robot arm to prevent unwanted moves, then alignment precision is improved, but thermal expansion causes deformation at high temperatures
Solution Approach 1:
The mounting interface incorporates localized compliance features at specific positions (e.g., flexible mounting elements at the interface between end effector and robot arm) that allow thermal expansion in non-critical directions while maintaining precise alignment in critical directions. This selective flexibility accommodates thermal effects without sacrificing alignment precision
3Adaptability or versatility
If the end effector operates at high temperatures to process substrates, then processing capability is improved, but droop and deformation increase due to thermal effects
Solution Approach 1:
The system utilizes controlled thermal expansion by designing the end effector with specific material properties and geometric parameters that allow predictable expansion at high temperatures. The angled mounting configuration and compliance features are calibrated to maintain functional alignment despite thermal parameter changes, enabling high-temperature operation without excessive droop or deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents drooping and deformation of the end effector during substrate transfer at high temperatures, maintaining high precision and alignment, even in densely packed environments.
Implementation Method 1
the end effector is mounted to the substrate handler at a position that the substrate supporting plane is at a second angle relative to a horizontal plane when no substrate is disposed on the free end, and the first angle is different from the second angle
Implementation Method 2
the end effector is secured to a robot arm with a clamp to allow for thermal expansion, ensuring precise alignment and stability at high temperatures
Data Source
Figure 1
Figure 2A~3
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AI summary
Embodiments of the present invention relate to high temperature anti-droop end effectors for transferring semiconductor substrates. One embodiment of the present invention provides an end effector (110; 210) for using with a substrate handler. The end effector (110; 210) comprises a free end (124; 224) having a substrate supporting plane configured to support a substrate and positioned that substrate at a first angle relative to a horizontal plane. The end effector (110; 210) comprises a fixed end (111; 211) configured to be mounted to the substrate handler, wherein the end effector (110; 210) is mounted to the substrate handler at a position that the substrate supporting plane is at a second angle relative to the horizontal plane when no substrate is disposed on the free end (124; 224), and the first angle is different from the second angle.