Angled Quasi-Non-Diffracting Laser Cutting for Clean Glass Separation

The patent replaces conventional mechanical cutting methods with a laser-based method that creates internal defects through optical absorption. The laser beam is focused at an angle to create a line of defects within the substrate, eliminating mechanical contact and the associated dust generation. This substitution of mechanical cutting with optical processing resolves the contradiction by maintaining high cutting speed while eliminating harmful particles.

The patent utilizes phase transitions in the laser beam propagation by creating a quasi-non-diffracting beam that maintains its focal line over an extended depth range. This allows the laser to maintain consistent energy density throughout the cutting depth, enabling complete separation without generating excessive debris that would require cleaning. The phase-modified beam structure ensures efficient energy transfer throughout the material thickness.

The patent performs preliminary action by creating a controlled line of internal defects at a specific angle within the substrate before final separation. This angled defect line pre-determines the fracture path, ensuring that when separation occurs, the edges naturally form at the desired angle without requiring subsequent mechanical beveling or rounding. This preliminary structuring of the defect line simultaneously achieves cutting simplicity and edge reliability.

The patent changes the critical parameter of defect orientation from the conventional perpendicular-to-surface configuration to an angled configuration (greater than 10 degrees from perpendicular). This parameter change in the defect line angle fundamentally alters the resulting edge geometry, producing inherently stronger angled edges that resist breakage while maintaining process simplicity. The modified defect angle parameter directly addresses both ease of manufacture and edge reliability.

The patent replaces mechanical grinding and polishing operations with a purely optical process. By controlling the laser beam parameters and focusing angle, the desired angled edges are created directly through internal defect formation and subsequent fracture, eliminating the need for mechanical removal of material. This substitution eliminates entire process steps while maintaining or improving edge strength through the controlled defect geometry.

The patent performs the edge-forming action during the initial cutting process rather than as a subsequent operation. The angled defect line is created simultaneously with the separation process, pre-establishing the final edge geometry. This preliminary formation of the desired edge structure during cutting eliminates the need for follow-up grinding or polishing steps, directly addressing the time loss issue while preserving edge reliability.

The patent fundamentally changes the beam parameter by transforming a conventional diverging laser beam into a quasi-non-diffracting beam with a maintained focal line over an extended axial range. This parameter change in beam propagation characteristics allows the focal line to remain sharp and well-defined throughout a much greater depth, simultaneously preserving laser processing power and maintaining manufacturing precision at depth. The modified beam parameter enables both high power delivery and precise focal control.

The patent introduces dynamic control of the laser beam focusing system to adapt to different processing depths and angles. By dynamically adjusting the focusing optics and beam parameters, the system maintains optimal focal line quality throughout the substrate thickness. This dynamic adaptation ensures that both processing power and focal precision are optimized for each specific processing condition, resolving the contradiction between depth capability and precision maintenance.