Glass Severing Apparatus TRIZ Cases

Softened glass is molded between projection and recess tools to form convex cavities for hermetic wafer-level packaging with lower thermal stress.

Ultrashort pulse laser filaments plus thermal stressing enable splinter-free separation of curved or closed planar glass sections.

Overlapped sub-nanosecond laser pulses below the damage threshold cut thin substrates with less thermal stress, micro-cracking, and edge damage.

A Bessel laser weakens glass sheets and the interlayer in one pass, enabling faster laminated glass separation with good edge quality.

Ultrashort laser pulses create spaced filament defects that guide brittle-hard substrate cleaving with strong edges, less post-processing, and tolerance to spot deviation.

Dual-laser cutting and pre-heating stabilize breaking guide lines in brittle materials, reducing chipping and improving hole formation success.

A sprayed chemical mixture and laser heating cut ultra-thin glass while driving ion exchange to strengthen vulnerable cut regions.

Laser-induced glass deformation followed by selective etching forms clean micro vias while tuning aspect ratio through etchant concentration.

Thermal shock chamfers glass edges, while pre-cutting the peeled strip prevents weight-induced defects and preserves substrate strength.

Surface-absorbed laser heating creates interacting thermal gradients that split brittle-hard materials into precise chips or chamfers without chemicals.

Laser-defined crack guidance separates curved solid layers with low kerf loss and Ra/Sa below 1 µm, avoiding polishing and grinding.

Ultrashort laser pulses create through-thickness modifications in ultrathin glass for stable separation with minimal damage and clean edges.

Feed-amount and reaction-force detection guide wire stop, laser stop, and cutting-laser separation to prevent weld-end damage.

Ultrashort laser perforations plus CO2 thermal stress enable precise glass separation with minimal sub-surface damage and debris.

A pulsed defect-forming beam synchronized with annular infrared heating separates glass faster while minimizing debris, defects, and strength loss.

Laser slit cutting, edge etching, tempering, and micro-etching simplify foldable glass production while reducing defects and raising yield.

Ultrashort pulses and a birefringent beam shape create precise damage lines in glass, then chemical etching separates clean cuts with minimal edge irregularity.

By matching laser polarization or frequency to coating optics, this case cuts coated glass with less debris and subsurface damage.

Multiple sub-beams focused in spaced focal planes raise modification density while limiting interference, improving transparent material severing.

Measured tube diameter and conveyor speed guide laser timing and direction, enabling one-stage circumferential cutting without rotating drives.

Offset heating behind laser-made material modifications enables precise separation of transparent workpieces with controlled geometry and lower roughness.

Alternating laser passes with water-filled engravings enables clean through-cuts in borosilicate and ceramic glass, including curved shapes.

Controlled laser defects guide substrate breaking along a contour line, preventing chipping, cracking, and coating damage.

Laser-formed shield tunnels and separation layers speed precise shaping of glass, quartz, and silicon carbide molded articles.

Phase-modified focal lines create angled internal defects in transparent workpieces, enabling cleaner glass separation with less dust and edge breakage.

Phase-imprinted beam splitting creates focus elements with depth-tuned intensities, improving homogeneous glass modification and separation quality.

Pulsed laser flaws and etching form glass channels with controlled taper angles, simplifying process control while preserving precise geometry.

Beam deflectors and dual optics switch beam widths in real time, changing line focus during glass processing without manual downtime.

A moving Bessel beam focus line improves crack uniformity and incision quality in glass processing while reducing cutting time.

An intermediate-index sacrificial layer lets laser beams cut textured transparent substrates with cleaner separation and less subsurface damage.

Ultrashort-pulse laser flaws plus slow etching form precise glass channels with rounded depressions that limit stress and preserve thin-glass strength.

A two-stage laser-assisted etching process raises etchant flow after breakthrough to reduce taper and improve ultrafine glass through-hole precision.

An offset oscillating infrared beam heats the dummy region to separate coated substrates while reducing debris and subsurface damage.

Burst laser pulses form spaced void columns along the dicing path to cut glass wafers with lower roughness and less thermal stress.

Spaced focal zones and controlled modification gaps help laser machining form parallel cracks for smooth separation with less workpiece damage.

Phase-shaped partial beams create depth-tuned focus intensities for uniform transparent material modification with smoother edges and fewer cracks.

Multi-sub-pulse laser bursts create focal-line defects in transparent workpieces, enabling faster, cleaner separation with less damage.

Pulsed laser faults guide brittle substrate fracture along complex lines while lowering breaking tension and preserving strong, clean edges.

Wavelength-dependent focusing and filtering let a pulsed polychromatic laser tune processing depth and improve glass fracture surface quality.

Two-stage laser processing plus wet etching forms chamfered glass window edges that keep thin profiles while improving strength.

Asymmetric laser-processed edge marks let brittle material chips divide cleanly while maintaining flexibility and fracture resistance in flexible displays.

An oscillating infrared beam heats defects in a dummy region to separate coated substrates while limiting debris and damage to the primary region.

Two-stage laser irradiation and wet etching create chamfered glass window edges that preserve slimness while improving strength against shock.

Line-focus stress zones guide crack propagation in glass separation, producing smoother faces and stronger edges without material removal.

Pulsed laser-formed shield tunnels let glass plates bend under external force while preserving thickness and strength through etching.

A multi-peak Bessel beam cuts and chamfers display glass in one pass, reducing process complexity while producing smooth arc-shaped edges.

Laser-induced internal modifications guide crack propagation for wafer separation with low kerf loss, reduced roughness, and less subsurface damage.

Line-focus stress zones guide cracks along a defined glass separation face, improving edge strength and reducing roughness without material removal.

Laser scribing plus preset-frequency vibration cuts rotating brittle bodies cleanly, reducing polishing needs and supporting rotary-shaft shapes.

Burst laser pulses form fine void lines in glass wafers, cutting optical devices with lower thermal stress and sidewall roughness below 0.3 μm.

Two-stage laser cutting and heating plus non-thermal blanking improves brittle-material hole formation by aligning guide lines and reducing chipping.

A radially offset laser through an aspheric optic forms angled defects in glass, enabling cleaner separation with stronger edges and less dust.

Pulsed laser perforation plus heating laser separation improves ring edge quality and processing efficiency in thick, narrow glass structures.