Brittle Material Hole Processing with Laser Pre-Breaking
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Solution Overview
Problem
The existing laser processing methods for brittle materials, such as glass, often result in low success rates due to chipping and uneven cutting surfaces, which affect the alignment and connection of breaking guide lines with the trajectory line of the standard hole, leading to breaking failures.
Innovation Solution
A processing method involving a first laser to cut a contour line and breaking guide line groups on the workpiece, followed by heating and pre-breaking with a second laser, and then processing a blanking hole using non-thermal methods, allowing the breaking guide line to intersect correctly with the contour line and release thermal stress, facilitating successful breaking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is used to improve processing efficiency, then productivity increases, but chipping occurs on the cutting surface leading to breaking failure
Solution Approach 1:
The method performs preliminary laser cutting to create a blanking hole and breaking guide line, then performs a second laser heating and breaking operation. This two-stage preliminary action allows the first cutting to create necessary structures while the second operation corrects alignment issues and completes the breaking process, resolving the contradiction between efficiency and precision.
Solution Approach 2:
The method changes laser parameters between operations - using appropriate laser power, speed, and focal position for cutting versus heating. By adjusting these parameters, the process achieves clean cutting in the first stage and controlled thermal breaking in the second stage, preventing chipping while maintaining efficiency.
2Ease of manufacture
If blanking hole is carved first by laser, then breaking guide line is cut, but chipping causes misalignment between breaking guide line and trajectory line
Solution Approach 1:
The method uses feedback by observing the actual position of the breaking guide line after first laser cutting, then adjusts the second laser heating position and parameters to compensate for any misalignment caused by chipping. This feedback mechanism ensures accurate intersection even when initial cutting has deviations.
Solution Approach 2:
The first laser cutting creates the blanking hole and breaking guide line as preliminary structures. These preliminary actions establish the basic geometry while allowing for subsequent correction and refinement in the second laser operation, ensuring final alignment accuracy.
3Manufacturing precision
If breaking guide line is cut in small breaking area with concentrated stress, then hole formation is achieved, but breaking guide line cracks outside trajectory line causing breaking failure
Solution Approach 1:
The method changes the laser operation mode from cutting to heating with different power and speed parameters. This parameter change allows thermal stress to be distributed more evenly, preventing crack propagation outside the trajectory line while still achieving successful breaking within the intended breaking area.
Solution Approach 2:
The method replaces direct mechanical force-based breaking with thermal field-based breaking. By using laser heating to induce thermal stress and controlled breaking, the process achieves more reliable and predictable breaking behavior compared to mechanical methods, increasing the breaking success rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the success rate of hole processing in brittle materials by preventing breaking guide lines from being outside the contour line, ensuring accurate intersection and reducing thermal stress, thereby improving the overall product processing success rate.
Implementation Method 1
cutting, by a first laser on a workpiece to be processed, a contour line of a preset standard hole and a plurality of breaking guide line groups located within the range of the contour line
Implementation Method 2
heating and pre-breaking the contour line and the breaking guide line of the breaking guide line groups on the workpiece to be processed by a second laser
Implementation Method 3
processing a blanking hole within the contour line on the workpiece to be processed by a non-thermal processing
Data Source
AI summary
A processing method of a brittle material is provided, which includes: cutting a contour line of a preset standard hole and a plurality of breaking guide line groups located within the contour line on a workpiece by a first laser, one end of a breaking guide line of the breaking guide line groups being connected with the contour line and the other end of the breaking guide line extending within the contour line; heating and pre-breaking the contour line and the breaking guide line on the workpiece by a second laser; processing a blanking hole within the contour line on the workpiece by a non-thermal processing, the extended end of the breaking guide line extending into the blanking hole; and breaking along the contour line and the breaking guide line on the workpiece to form a standard hole in the workpiece.