Laser-Perforated Ring Fabrication for Clean Edges in Thick Glass
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Solution Overview
Problem
Existing methods for fabricating ring structures from substrates, such as glass, are hindered by low yield, rough edges, slow processing times, and high costs, particularly due to poor edge quality and limitations in processing thickness and width.
Innovation Solution
A method combining laser perforation and heating laser processes to form inner and outer contours in a substrate, allowing for precise creation of ring structures with controlled perforations and subsequent separation, enabling higher thickness and smaller width processing capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional cutting methods are used to fabricate ring structures, then processing simplicity is maintained, but edge quality deteriorates and processing speed decreases
Solution Approach 1:
The cutting process is divided into two distinct stages: first, a pulsed laser creates a series of closely-spaced perforations along the cutting path; second, a heating laser causes thermal expansion that propagates cracks through the material along these perforation lines, enabling clean separation. This segmentation allows each laser type to be optimized for its specific function, achieving both high precision and efficiency.
Solution Approach 2:
The pulsed laser performs preliminary action by creating perforations that serve as stress concentration points and crack initiation sites before the actual cutting occurs. These pre-formed defects guide the subsequent thermal crack propagation, ensuring the crack follows the desired cutting path with high precision while reducing the energy needed for separation.
2Ease of manufacture
If conventional fabrication methods are used, then equipment complexity is low, but manufacturing cost increases and yield decreases
Solution Approach 1:
The invention replaces traditional mechanical cutting systems with a dual-laser system that uses optical and thermal fields to achieve cutting. The pulsed laser creates perforations through photoablation, and the heating laser induces thermal stress for crack propagation, eliminating the need for mechanical contact and associated tool wear, positioning errors, and tool changes.
3Productivity
If existing laser cutting methods are used, then processing speed is maintained, but edge quality deteriorates due to rough edges
Solution Approach 1:
The invention changes the parameters of laser interaction with the material by using a pulsed laser regime instead of continuous wave, creating discrete perforations rather than continuous melting. The heating laser then operates at controlled power levels to induce thermal expansion and crack propagation without excessive melting, resulting in cleaner edges while maintaining processing speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved edge quality, increased processing efficiency, and the ability to fabricate ring structures with higher thickness and smaller widths than previous methods, addressing the limitations of existing techniques.
Implementation Method 1
directing a pulsed laser beam focal line into a substrate at a plurality of locations, the pulsed laser beam focal line generating an induced absorption within the substrate at each of the locations, the induced absorption producing one of the plurality of perforations
Implementation Method 2
heating the outer contour with a heating laser beam such that an article separates from the substrate at the outer contour, heating a region of the article between an outer edge of the article and the inner contour with the heating laser beam
Data Source
AI summary
Systems and methods for fabricating ring structures are disclosed. In one embodiment, a method of forming a ring structure includes forming an inner contour and an outer contour including a plurality of perforations by directing a pulsed laser beam focal line into a substrate at a plurality of locations, the pulsed laser beam focal line generating an induced absorption within a substrate at each of the locations, the induced absorption producing one of the plurality of perforations. The method further includes heating the outer contour with a heating laser beam such that an article separates from the substrate at the outer contour, heating a region of the article between an outer edge of the article and the inner contour with the heating laser beam, and removing an inner portion of the article at the inner contour to form the ring structure.