Glass Through-Hole Etching with Two-Stage Flow Control

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Solution Overview

Problem

The existing method for manufacturing glass sheets with through holes results in tapered inner walls due to uneven etching, preventing the formation of ultrafine patterns and varying inclination angles, which are influenced by etching conditions.

Innovation Solution

A method involving a modifying step using laser irradiation followed by a two-stage etching process, where the average relative velocity of the etchant is increased after the preset formation part penetrates, enhancing etchant exchange efficiency and promoting uniform etching across the glass sheet.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a through hole is formed by etching a modified part that extends from the first main surface to the second main surface, then a through hole can be formed efficiently, but the inner wall surface becomes tapered with a larger hole diameter at the main surface

Engineering Contradiction:
Improvethrough hole formation efficiencyVSAvoidhole diameter uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The etching process is divided into two distinct stages: a first etching step that etches the modified part to form a through hole, and a second etching step that performs additional etching after the through hole is formed. This segmentation allows different etching conditions to be applied at different stages to control the hole diameter uniformity while maintaining formation efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent dynamically adjusts etching conditions by changing the relative velocity between the etchant and the glass sheet between the two etching steps. The etching conditions are made variable rather than static, allowing optimization of both productivity and precision at different stages of the process.

Inventive Principle:
Principle #15Dynamics

2Ease of manufacture

If the hole diameter at the main surface is large due to prolonged etchant contact, then etching can proceed thoroughly, but ultrafine patterns cannot be formed in the main surface

Engineering Contradiction:
Improveetching completenessVSAvoidpattern fineness
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The first etching step performs the preliminary action of forming the through hole by etching the modified part. The second etching step then performs the additional action of controlling the final hole dimensions. This preliminary action approach allows the etching process to be staged, ensuring both completeness and precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the etching parameters, specifically the relative velocity of the etchant, between the two etching steps. By adjusting this parameter dynamically, the process achieves both thorough etching and precise hole diameter control, enabling ultrafine pattern formation.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If the inclination angle of the inner wall surface varies with etching conditions, then etching can be adjusted for different needs, but consistent pattern formation becomes difficult

Engineering Contradiction:
Improveetching condition flexibilityVSAvoidpattern consistency
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The two-stage etching process provides feedback control for the inclination angle. The first etching step creates the through hole with a certain inclination, and the second etching step adjusts the final inclination angle based on the state after penetration. This feedback mechanism ensures consistent pattern formation while maintaining adaptability.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach increases the inclination angle of the inner wall surface of the through hole, ensuring a more uniform and precise pattern formation, thereby enabling the creation of ultrafine patterns on the glass sheet.

Implementation Method 1

a modifying step of modifying a preset formation part for a through hole by irradiation of laser light

Methodology Applied
Scientific EffectLaser irradiation: Laser

Implementation Method 2

an etching step of etching the glass sheet while immersing the glass sheet in an etchant, to form the through hole in the preset formation part

Methodology Applied
Scientific EffectChemical etching:

Data Source

PatentUS20250011229A1Method for manufacturing glass plate
Publication Date: 2025.01.09 NIPPON ELECTRIC GLASS CO LTD
  • US20250011229A1 patent drawing
  • US20250011229A1 patent drawing
  • US20250011229A1 patent drawing

AI summary

A method includes a modifying step of modifying a preset formation part for a through hole by irradiation of laser light, and an etching step of etching a first main surface and a second main surface while immersing a glass sheet in an etchant, to form the through hole in the preset formation part, after the modifying step. The etching step includes a first etching step of etching the glass sheet in which the preset formation part does not penetrate, and a second etching step of etching the glass sheet in which the preset formation part penetrates, after the first etching step. An average relative velocity of the etchant with respect to the glass sheet in the second etching step is higher than that in the first etching step.