Synchronous Dual-Laser Glass Separation With Low Debris Cutting
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Solution Overview
Problem
Current methods for cutting and separating glass substrates are inefficient, costly, and result in significant debris and defects, lacking a fast, clean, and reliable process.
Innovation Solution
A method involving synchronized use of a pulsed laser beam to create defects and an infrared laser beam to heat the glass, inducing thermal stress for separation, reducing processing time and minimizing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional laser cutting methods are used on transparent workpieces, then the workpiece can be separated, but significant debris and defects are generated and processing time is extended
Solution Approach 1:
The laser processing is divided into two distinct wavelength components: a first wavelength (e.g., ultraviolet or visible) that generates minimal debris and defects by creating a separation path, and a second wavelength (e.g., infrared) that heats the workpiece to induce thermal stress and accelerate separation. This segmentation of the laser beam into different wavelength functions allows simultaneous achievement of clean cutting and rapid processing without the trade-off present in conventional single-wavelength methods
Solution Approach 2:
The invention changes the parameter of laser wavelength from a single wavelength to a dual-wavelength configuration. The first wavelength is selected to minimize material damage and debris generation, while the second wavelength is selected to maximize thermal stress and separation speed. By adjusting these wavelength parameters independently, the system resolves the contradiction between processing speed and quality
2Loss of time
If faster processing methods are used to increase productivity, then processing time is reduced, but manufacturing precision and workpiece integrity may deteriorate
Solution Approach 1:
The laser system is segmented into two functional components operating simultaneously: one wavelength dedicated to precision path creation with minimal damage, and another wavelength dedicated to rapid thermal separation. This functional segmentation allows the system to achieve fast processing speeds without compromising separation quality or workpiece integrity, as each wavelength performs its specialized function optimally
Solution Approach 2:
The first wavelength acts as an intermediary that prepares the workpiece by creating a precise separation path with minimal debris, which then enables the second wavelength to efficiently induce thermal stress and complete the separation. This intermediary step ensures that the rapid thermal processing does not compromise precision, as the separation path is already established by the first wavelength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables rapid, clean separation of glass substrates with minimal debris and defects, preserving workpiece integrity and strength.
Implementation Method 1
a pulsed laser beam is utilized to create a series of defects in the transparent workpiece
Implementation Method 2
an infrared laser beam is utilized to heat the transparent workpiece along or near the contour line
Implementation Method 3
heating the transparent workpiece along or near the contour line, thereby causing the transparent workpiece to separate
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser beam spot on the transparent workpiece and producing a defect within the transparent workpiece, directing an infrared laser beam output onto the transparent workpiece to form an annular infrared beam spot that circumscribes the pulsed laser beam spot at the imaging surface and heats the transparent workpiece. Further, the method includes translating the transparent workpiece and the pulsed laser beam focal line relative to each other along a separation path and translating the transparent workpiece and the annular infrared beam spot relative to each other along the separation path synchronous with the translation of the transparent workpiece and the pulsed laser beam focal line relative to each other.