Glass Substrate Heat Chamfering With Pre-Cut Strip Control
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Solution Overview
Problem
Existing heat chamfering methods for glass substrates do not adequately increase the strength of the glass substrate, as the strength is often reduced due to localized defects caused by the weight of the peeled strip during the chamfering process.
Innovation Solution
A method and apparatus that applies thermal shock to chamfer the edges of a glass substrate, followed by cutting the peeled strip at a predetermined point to prevent breakage and localized defects, using heat, a laser beam, or a flame to ensure precise cutting without mechanical impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heat chamfering is performed by peeling off a strip from the glass substrate edge, then defects are removed from the edges and strength is increased, but the strip may break due to its own weight causing localized defects that reduce strength
Solution Approach 1:
The strip is cut at a predetermined position before it breaks due to its own weight. This preliminary cutting action prevents the strip from breaking and causing localized defects on the glass substrate edge, thereby maintaining the strength enhancement achieved through heat chamfering.
Solution Approach 2:
The continuous strip peeled from the glass substrate is divided into segments by cutting it at a predetermined position. This segmentation prevents the entire strip from breaking under its own weight, eliminating the risk of localized defects while still achieving the desired edge chamfering effect.
2Reliability
If the strip is allowed to remain attached to prevent breakage, then localized defects are avoided, but the strip weight causes stress on the glass substrate reducing strength enhancement
Solution Approach 1:
Instead of leaving the strip attached or allowing it to break naturally, the invention performs a preliminary cutting action at a predetermined position. This resolves the contradiction by eliminating both the weight stress on the substrate and the risk of breakage-induced defects.
3Strength
If thermal shock is applied to chamfer the edge, then defects are removed and edge strength is increased, but the process requires precise control to avoid excessive heating
Solution Approach 1:
The heating element is moved continuously along the edge of the glass substrate, applying thermal shock in a controlled manner. This continuous motion ensures uniform heating along the edge while preventing excessive localized heating, achieving both edge strength enhancement and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and apparatus significantly enhance the strength of the glass substrate by preventing strip breakage and reducing localized defects, resulting in smoother edges and increased structural integrity.
Implementation Method 1
chamfering an edge of a glass substrate by applying thermal shock to the edge of the glass substrate
Implementation Method 2
the heating element may be heated by high frequency induction
Implementation Method 3
the cutting may cut the strip by applying at least one of heat and a laser beam to the predetermined point
Implementation Method 4
the cutting may cut the strip by applying at least one of heat and a laser beam to the predetermined point
Implementation Method 5
the cutting may cut the strip by applying a flame of a torch to the predetermined point
Data Source
AI summary
Provided is a glass substrate heat chamfering method. An edge of a glass substrate (100) is chamfered by applying thermal shock to the edge of the glass substrate (100), thereby peeling a strip (100a) off from the edge of the glass substrate (100). The strip is cut at a predetermined point thereon before being broken due to the weight thereof. The strip (100a) is cut by applying at least one of heat and a laser beam to the predetermined point or by applying a flame (300a) of a torch (300) to the predetermined point. The application of the thermal shock includes brining a heating element (210) into contact with the edge of the glass substrate (100). In the chamfering, the heating element (210) is relatively moved along the edge of the glass substrate (100) while being brought into contact with the edge of the glass substrate (100).