Brittle Material Hole Processing with Pre-Breaking Guide Lines
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Solution Overview
Problem
Existing laser processing methods for brittle materials, such as glass, suffer from low success rates due to chipping and misalignment of breaking guide lines, leading to incomplete hole formation and reduced product quality.
Innovation Solution
A method involving a first laser to cut a contour line and breaking guide lines, followed by heating and pre-breaking with a second laser, and then forming a standard hole through non-thermal processing, such as mechanical drilling, to ensure accurate alignment and stress relief.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is used to process holes in brittle materials, then processing efficiency is greatly improved, but edge chipping occurs leading to breaking guide line misalignment and low success rate
Solution Approach 1:
The method performs preliminary laser cutting to create a blanking hole and breaking guide line, then performs preliminary heating along the breaking guide line before final breaking. This preliminary action prepares the stress distribution in advance, allowing the breaking guide line to remain stable even after blanking hole removal, thus preventing misalignment and improving precision while maintaining high productivity
Solution Approach 2:
The patent applies beforehand cushioning by performing laser heating treatment along the breaking guide line before the actual breaking process. This heating creates a buffered stress zone that prevents stress concentration and guides the breaking process smoothly, cushioning against the harmful effects of edge chipping and ensuring precise alignment throughout the process
2Ease of manufacture
If blanking hole is carved first by laser, then breaking guide line is cut, but edge chipping causes breaking guide line to not match preset position, resulting in breaking failure
Solution Approach 1:
The method performs preliminary laser cutting to create a blanking hole and breaking guide line, then performs preliminary heating along the breaking guide line before final breaking. This preliminary action prepares the stress distribution in advance, allowing the breaking guide line to remain stable even after blanking hole removal, thus preventing misalignment and improving precision while maintaining high productivity
Solution Approach 2:
The patent converts the harmful edge chipping effect into a beneficial stress concentration zone by applying laser heating. The heating process transforms the irregular edge caused by chipping into a controlled thermal stress field that actually helps guide the breaking process along the intended path, turning the manufacturing defect into a process advantage
3Strength
If breaking guide line is cut in small breaking area with concentrated stress, then breaking can be achieved, but the guide line is prone to crack outside trajectory line, causing breaking failure
Solution Approach 1:
The method performs preliminary laser heating along the breaking guide line before the actual breaking process. This preliminary heating pre-distributes the thermal stress along the entire intended breaking path, ensuring that when breaking occurs, the stress follows the predetermined trajectory accurately even in small breaking areas with concentrated stress, preventing cracks from deviating outside the trajectory line
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the success rate of hole formation in brittle materials by preventing edge chipping and ensuring precise alignment of breaking guide lines, resulting in high-quality and complete hole processing.
Implementation Method 1
cutting by a first laser on a workpiece to be processed, a contour line of a preset standard hole and a plurality of breaking guide line groups
Implementation Method 2
heating and pre-breaking the contour line and the breaking guide line of the breaking guide line groups on the workpiece to be processed by a second laser
Data Source
Figure 1
Figure 2a~2f
Figure 3a~3f
AI summary
A processing method of a brittle material is provided in the disclosure, which includes: cutting a contour line of a preset standard hole and a plurality of breaking guide line groups located within the contour line on a workpiece to be processed by a first laser, one end of a breaking guide line of the breaking guide line groups being connected with the contour line and the other end of the breaking guide line extending within the contour line; heating and pre-breaking the contour line and the breaking guide line of the breaking guide line groups on the workpiece by a second laser; processing a blanking hole within the contour line on the workpiece by a non-thermal processing, the extended end of the breaking guide line of the breaking guide line groups extending into the blanking hole; and breaking along the contour line and the breaking guide line of the breaking guide line groups on the workpiece to form a standard hole in the workpiece. The processing method of the brittle material has high processing success rate.