Laser Scribe Substrate Separation for Chip-Free Coated Edges
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Solution Overview
Problem
Conventional methods for cutting and separating substrates using laser beams often cause chipping or cracking and damage coatings on the substrate.
Innovation Solution
A system comprising a laser processing system and a substrate breaking system that uses a laser beam to form a contour line with defects of about 10 microns or less, followed by applying forces to separate the substrate along this line without damaging it.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam is used to cut or separate substrates conventionally, then the substrate can be separated along a scribe line, but chipping or cracking occurs in the substrate and coatings are damaged
Solution Approach 1:
The laser forms a scribe line with controlled defects in advance before the mechanical breaking step. This preliminary action creates a predetermined fracture path that guides where the substrate will break, ensuring clean separation without chipping or cracking during the actual breaking process.
Solution Approach 2:
The cutting process is divided into two distinct stages: (1) laser scribe line formation with controlled defects, and (2) mechanical breaking along the scribe line. This segmentation allows each stage to be optimized independently - the laser stage creates the fracture path while the mechanical stage executes the clean break.
2Productivity
If conventional laser cutting methods are used, then substrate separation is achieved, but unwanted chipping or cracking is caused
Solution Approach 1:
The laser parameters are specifically optimized to create controlled defects only along the scribe line location, while the rest of the substrate remains unaffected. This localized defect formation ensures that breaking occurs only at the intended location without causing unintended chipping or cracking in other areas of the substrate.
3Productivity
If conventional laser methods are applied to the scribe line, then cutting is achieved, but a coating applied to the substrate surface is damaged
Solution Approach 1:
The laser applies energy partially - just enough to create the scribe line with controlled defects without excessive energy that would damage the coating. The laser parameters are tuned to achieve the minimum necessary effect (scribe line formation) without over-processing that would harm the coating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently cuts and separates substrates with enhanced edge quality, preventing cracking or chipping and maintaining the integrity of the substrate and any applied coatings.
Implementation Method 1
a laser beam to form a scribe line along the substrate
Implementation Method 2
either a mechanical force or another laser is applied to the scribe line to cut or separate the substrate along the scribe line
Data Source
AI summary
A method of forming a plurality of defects within a substrate with a laser beam focal line using a laser beam, each defect of the plurality of defects being a damage track within the substrate with a diameter of about 10 microns or less, the plurality of defects forming a contour line on the substrate. The substrate having a first surface and a second surface that is opposite from the first surface. The method further includes exerting (i) a first force on the first surface of the substrate at a location that is adjacent to the contour line and (ii) a second force on the second surface of the substrate at a location that is on the contour line. Additionally, the method includes breaking the substrate along the contour line and into a first substrate portion and a second substrate portion.