Bessel Beam Focus-Line Scanning for Precise Glass Laser Cutting

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Solution Overview

Problem

Existing laser processing systems face challenges in achieving high-speed and precise processing of workpieces, particularly with brittle materials like glass substrates, where non-uniform cracks and uneven incision surfaces are common issues.

Innovation Solution

A laser processing system that modulates a laser beam into a Bessel beam, positioning the focus line on the workpiece and moving it within a predetermined range, while simultaneously controlling the movement of the workpiece and the Bessel beam to maintain an optimal angle for processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional laser beam is used for processing glass substrates, then the processing can be performed, but cracks are generated non-uniformly and the incision surface is uneven

Engineering Contradiction:
Improveincision surface uniformityVSAvoidcrack uniformity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the fundamental parameter of the laser beam from a conventional Gaussian beam to a Bessel beam. This parameter change in beam type creates a different intensity distribution pattern with a central core and concentric rings, which fundamentally alters how the laser interacts with the glass substrate, resulting in uniform crack generation and smooth incision surfaces.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If an accurate process is used for cutting large area glass substrates, then processing quality is improved, but a lot of work time is taken

Engineering Contradiction:
Improveprocessing accuracyVSAvoidprocessing speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent introduces the dimension of beam propagation along the optical axis by using a Bessel beam with an extended focus line rather than a conventional point-focused Gaussian beam. This allows the laser to process large area glass substrates by moving the focus line across the surface, combining high precision with increased processing speed through efficient area coverage.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If the focus line of the Bessel beam is moved to expand irradiation area, then processing speed is improved, but maintaining optimal angle becomes more complex

Engineering Contradiction:
Improveprocessing speedVSAvoidoptical system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent designs the optical unit to perform multiple functions: generating the Bessel beam, positioning the focus line on the workpiece, and moving the focus line within a predetermined range. This multi-functional optical system consolidates several operations into a single unit, managing the complexity while enabling high-speed processing through focus line movement.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables high-speed and precise processing of workpieces by expanding the irradiation area through scanning and maintaining an optimal angle for processing, resulting in improved quality and reduced processing time.

Implementation Method 1

an optical unit disposed on a propagation path of the laser beam and modulating the incident laser beam into a Bessel beam

Methodology Applied
Scientific EffectBessel beam modulation:

Implementation Method 2

irradiating the Bessel beam to the workpiece and processing the workpiece

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS12303999B2Laser processing system using Bessel beam and method for processing workpiece using Bessel beam
Publication Date: 2025.05.20 PHILOPTICS CO LTD
  • US12303999B2 patent drawing
  • US12303999B2 patent drawing
  • US12303999B2 patent drawing

AI summary

A laser processing system according to an embodiment of the present invention includes: a laser unit emitting a laser beam; an optical unit disposed on a propagation path of the laser beam and modulating the incident laser beam into a Bessel beam; a stage on which a workpiece to be processed with the Bessel beam emitted from the optical unit is mounted; and a control unit for controlling the operations of the laser unit, the optical unit, and the stage, wherein the optical unit is configured to position the focus line of the emitted Bessel beam on the workpiece and to move the focus line positioned on the workpiece with a predetermined range.