Laser Beam Splitting for Homogeneous Transparent Material Severing

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Solution Overview

Problem

Existing laser processing methods struggle to achieve homogeneous material modifications and efficient material severing in transparent materials, as the intensity of focus elements varies with depth, leading to inconsistent material properties and potential crack formation.

Innovation Solution

A method involving a beam splitter to split the input laser beam into multiple partial beams with different phases, focusing them to form multiple focus elements with varying intensities, ensuring that at least two focus elements have distinct intensities to achieve consistent material modifications across different depths, thereby improving the homogeneity and quality of material severing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a single focus element is used for laser processing transparent materials, then the processing depth is limited, but the intensity varies with depth leading to inconsistent material properties and crack formation

Engineering Contradiction:
Improvehomogeneity of material modificationsVSAvoidcrack formation
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent divides a single laser beam into multiple partial beams using a beam splitter, creating multiple focus elements at different depths within the workpiece. This segmentation allows each focus element to be independently positioned and intensity-controlled, ensuring homogeneous material modifications throughout the processing depth while preventing crack formation caused by intensity variations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different intensities to different focus elements based on their depth positions within the workpiece. By adjusting the intensity of each focus element locally, the system compensates for depth-related attenuation and ensures consistent material modification quality throughout the entire processing volume, eliminating the intensity variation problems associated with single-focus methods.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If multiple focus elements with different intensities are used, then homogeneous material modifications are achieved across different depths, but the device complexity increases due to beam splitting and phase control mechanisms

Engineering Contradiction:
Improvehomogeneity of material modificationsVSAvoidbeam splitter and phase control system
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical beam splitting methods with phase-based beam splitting using diffractive optical elements or spatial light modulators. This substitution reduces mechanical complexity while enabling precise control over the number, position, and intensity of multiple focus elements through phase modulation of the laser beam.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The beam splitter and phase control system serves multiple functions simultaneously: it divides the beam into multiple partial beams, positions focus elements at different depths, and adjusts their intensities. This multi-functionality reduces the need for separate optical components for each function, thereby managing device complexity while achieving homogeneous material modifications.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Length of stationary object

If intensity is increased to ensure consistent material properties at greater depths, then processing depth is extended, but the risk of crack formation and harmful effects increases

Engineering Contradiction:
Improveprocessing depthVSAvoidcrack formation and material damage
Core Design Contradiction:
Length of stationary objectVSObject-affected harmful factors

Solution Approach 1:

Instead of using a single high-intensity focus element that risks causing cracks, the patent segments the laser energy into multiple focus elements distributed at different depths. Each focus element operates at an optimized, lower intensity level appropriate for its depth position, achieving extended processing depth without the harmful effects of excessive intensity concentration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the intensity parameter of each focus element based on its depth position within the workpiece. By adjusting intensity as a function of depth, the system extends processing depth to greater values while maintaining safe intensity levels that prevent crack formation and material damage, contrary to the approach of uniformly increasing intensity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of material modifications with identical properties independent of depth, resulting in improved homogeneity and quality of material severing, with optimized edge smoothness and reduced crack formation.

Implementation Method 1

splitting of the input laser beam is performed by application of phases to a beam cross section of the input laser beam

Methodology Applied
Scientific EffectPhase modulation: Phase Modulation

Implementation Method 2

focusing the plurality of partial beams decoupled from the beam splitter by using a focusing optical unit. Multiple focus elements are formed by the focusing of the plurality of partial beams

Methodology Applied
Scientific EffectFocusing: Focusing

Data Source

PatentUS12251776B2Method and device for laser processing a workpiece
Publication Date: 2025.03.18 TRUMPF LASER & SYSTEMTECHNIK SE
  • US12251776B2 patent drawing
  • US12251776B2 patent drawing
  • US12251776B2 patent drawing

AI summary

A method for laser processing a workpiece is provided. The workpiece includes a material transparent to a laser beam of the laser processing. The method includes splitting an input laser beam by using a beam splitter into a plurality of partial beams. The splitting of the input laser beam is performed by application of phases to a beam cross section of the input laser beam. The method further includes focusing the plurality of partial beams decoupled from the beam splitter by using a focusing optical unit. Multiple focus elements are formed by the focusing of the plurality of partial beams. The method further includes subjecting the material of the workpiece to at least a subset of the multiple focus elements. The application of the phases is performed in such a way that at least two of the multiple focus elements have different intensities.