Laser Separation of Coated Substrates With Offset Oscillating Beam Paths
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Solution Overview
Problem
Laser cutting processes for coated substrates often result in unacceptable debris and subsurface damage due to coating absorption of the laser beam and separation methods that fail to minimize defects and material damage.
Innovation Solution
A method involving an infrared laser beam directed onto a coated substrate with a coating layer on a transparent workpiece, where the beam applies thermal energy along a contour line to separate the substrate by tracing an oscillating pathway on the dummy region without melting or ablating the primary region, using techniques such as oscillating pathways, modified energy distributions, and annular beam shapes to control thermal energy application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam is directed onto a coated substrate for cutting, then separation of the substrate is achieved, but the coating absorbs the laser beam causing unacceptable debris and subsurface damage
Solution Approach 1:
The patent applies different regions of the laser beam (Gaussian profile) to different regions of the substrate. The high-intensity center region targets the contour line for separation, while the lower-intensity outer regions apply thermal energy to the dummy region without causing damage to the primary region. This spatial differentiation of energy distribution resolves the contradiction by enabling effective separation while minimizing harmful effects.
Solution Approach 2:
Instead of directing the laser beam directly along the contour line (conventional approach), the patent inverts the approach by offsetting the beam path to trace an oscillating pathway on the dummy region. This indirect approach allows thermal energy to propagate to the contour line through the substrate, achieving separation while avoiding direct exposure of the primary region to high-intensity laser energy, thus reducing debris and subsurface damage.
2Productivity
If thermal energy is applied along the contour line to induce separation, then substrate separation is achieved, but the primary region may suffer from melting or ablation
Solution Approach 1:
The patent utilizes the spatial variation in laser beam intensity (Gaussian profile) to apply different energy levels to different regions. The high-intensity center region is positioned to target the contour line for rapid separation, while the lower-intensity regions are positioned over the dummy region, ensuring that the primary region receives insufficient energy to cause melting or ablation. This resolves the contradiction by enabling fast separation while protecting the primary region.
Solution Approach 2:
The patent transitions from a one-dimensional approach (direct linear scanning along the contour) to a two-dimensional oscillating pathway that traces back and forth on the dummy region. This dimensional change allows the laser beam to remain offset from the contour line while still delivering thermal energy to induce separation, thereby preventing damage to the primary region while maintaining separation efficiency.
3Manufacturing precision
If the laser beam path is offset from the contour line to protect the primary region, then damage to the primary region is reduced, but separation efficiency decreases
Solution Approach 1:
The patent employs periodic oscillation of the laser beam path across the dummy region. This oscillating motion allows the beam to repeatedly trace back and forth along the offset path, accumulating thermal energy in the dummy region and propagating it to the contour line over time. The periodic action compensates for the offset distance, maintaining separation efficiency while keeping the primary region protected throughout the process.
Solution Approach 2:
The patent applies thermal energy preliminarily to the dummy region before the separation front reaches the primary region. By pre-heating the dummy region and allowing thermal propagation to the contour line, the separation process is initiated and advanced in a controlled manner, ensuring that the primary region remains intact while separation efficiency is maintained through cumulative thermal effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively separates coated substrates with minimal damage to the primary region, reducing debris and subsurface defects, while ensuring precise control over thermal energy application to induce separation along the desired contour line.
Implementation Method 1
the infrared laser beam applies thermal energy to the plurality of defects disposed in the coated substrate and inducing separation of the coated substrate along the contour line
Data Source
AI summary
A method of separating a coated substrate includes directing an infrared laser beam onto a first surface of the coated substrate. The coated substrate includes a coating layer disposed on a transparent workpiece, a plurality of defects is disposed within the coated substrate along a contour line that divides a primary region from a dummy region of the coated substrate from a dummy region of the coated substrate. The method also includes translating at least one of the coated substrate and the infrared laser beam relative to each other such that an infrared beam spot traces an oscillating pathway that follows an offset line in a translation direction and oscillates between an inner and outer track line, the oscillating pathway is disposed on the dummy region of the coated substrate, and the infrared laser beam applies thermal energy to the plurality of defects to induce separation of the coated substrate.