Brittle Material Chip Edge Marks for Flexible Display Bending

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Solution Overview

Problem

Conventional brittle material chips used for flexible displays suffer from insufficient flexibility due to processed marks on their end surfaces, which can lead to fracture during deformation.

Innovation Solution

A brittle material chip with first processed marks on one side of the brittle material layer, having depths of 1 μm or more but less than half the thickness of the layer, and optionally second processed marks on the other side with depths of less than 1 μm, to enhance flexibility without hindering division.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional laser machining is used to divide the brittle material sheet, then the brittle material chip can be formed, but processed marks with large depth and different surface texture are created on the end surfaces, causing insufficient flexibility

Engineering Contradiction:

Improveprocessed mark depth controlVSAvoidflexibility

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent applies parameter changes by precisely controlling the ultrashort pulsed laser processing parameters to create processed marks with specific depth characteristics. The first processed marks are controlled to have depths of 1 μm or more and less than half the thickness of the brittle material layer, while the second processed marks are controlled to have depths of less than 1 μm. This parameter control resolves the contradiction by achieving both manufacturing precision and flexibility.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies local quality by creating different types of processed marks at different locations within the brittle material layer. The first processed marks are formed on one side with greater depth (1 μm or more), while the second processed marks are formed on the other side with minimal depth (less than 1 μm). This local differentiation allows the end surfaces to have appropriate properties for both division and flexibility.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If processed marks are formed on both sides of the brittle material layer with significant depth, then division along planned division lines is facilitated, but the brittle material chip becomes rigid and prone to fracture during deformation

Engineering Contradiction:

Improvedivision easeVSAvoidfracture resistance

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent resolves this contradiction by changing the depth parameter of processed marks on different sides of the brittle material layer. The first processed marks have depths of 1 μm or more (facilitating division), while the second processed marks have depths of less than 1 μm (maintaining fracture resistance). This asymmetric parameter control allows both division ease and fracture resistance to be achieved simultaneously.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies partial action by forming processed marks with different depths on opposite sides of the brittle material layer. Instead of forming deep processed marks on both sides (excessive action), the patent forms shallow second processed marks on one side while maintaining deeper first processed marks on the other side. This partial approach ensures division ease without compromising fracture resistance.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution provides a brittle material chip with sufficient flexibility to prevent fracture during deformation, making it suitable for use in flexible displays.

Implementation Method 1

forming first processed marks on one side in a thickness direction of the brittle material layer on at least one end surface of the brittle material layer by removing brittle material with an ultrashort pulsed laser source

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20250034023A1Brittle material chip, brittle material sheet, method for producing brittle material sheet, and method for producing brittle material chip

Publication Date: 2025.01.30 NITTO DENKO CORP

AI summary

An objective of the present invention is to provide a brittle material chip and the like having excellent flexibility. The present invention is a brittle material chip including a brittle material layer formed of a brittle material. The brittle material chip includes first processed marks formed on one side in a thickness direction of the brittle material layer on at least one end surface of the brittle material layer and having depths of 1 μm or more and less than half the thickness of the brittle material layer and includes or does not include second processed marks formed on the other side in the thickness direction on the end surface of the brittle material layer, facing the first processed marks in the thickness direction, and having depths of less than 1 μm.