Angled LED Chip Orientation in Reflective Cups
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Solution Overview
Problem
Conventional LED displays experience significant light wastage and image quality variations due to peak emission characteristics being perpendicular to the viewer's line of sight, especially when mounted elevated, leading to inefficient light distribution and inconsistent brightness across different viewing angles.
Innovation Solution
LED packages are designed with LED chips rotated within the reflective cup or mounted on a substrate, allowing for unique far-field pattern (FFP) characteristics that provide wider horizontal and vertical viewing angles and improved uniformity, reducing the need for diffusers and enhancing emission intensity and consistency across various angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED chips are mounted with peak emission perpendicular to the viewer's line of sight, then the LED package structure is simple and conventional, but light distribution is inefficient and image quality varies significantly at different viewing angles
Solution Approach 1:
The patent applies asymmetry by rotating the LED chip within the reflective cup so that the chip's longitudinal axis is angled relative to the cup's longitudinal axis. This asymmetric orientation changes the far-field emission pattern from a conventional perpendicular peak to an angled peak that better matches elevated mounting viewing angles, thereby improving light distribution efficiency without significantly complicating the manufacturing process
Solution Approach 2:
The patent changes the emission angle parameter of the LED package by rotating the LED chip at specific angles (e.g., 15-75 degrees) relative to the reflective cup axis. This parameter modification transforms the far-field pattern to optimize light emission at elevated mounting angles, directly addressing the inefficient light distribution problem while maintaining conventional package structures
2Ease of manufacture
If conventional LED packages are used with perpendicular peak emission, then manufacturing is straightforward, but image quality is inconsistent across different viewing angles
Solution Approach 1:
By introducing asymmetric orientation of the LED chip within the reflective cup, the patent modifies the far-field emission pattern to provide more uniform image quality across different viewing angles. The angled configuration (15-75 degrees from the cup axis) creates a broader, more consistent light distribution that reduces image quality variations when viewed from different positions, while the assembly process remains relatively simple
Solution Approach 2:
The patent modifies the emission angle parameter by rotating the LED chip to specific orientations within the reflective cup. This parameter change transforms the conventional perpendicular emission pattern into an angled pattern that maintains consistent brightness and image quality across a wider range of viewing angles, directly addressing the image quality uniformity issue
3Adaptability or versatility
If LED chips are rotated within the reflective cup to achieve wider viewing angles, then light emission pattern is optimized and viewing angle is increased, but the mounting configuration becomes more complex
Solution Approach 1:
The patent uses asymmetric orientation of the LED chip within the reflective cup to achieve wider horizontal and vertical viewing angles. The rotated configuration (with the chip longitudinal axis at an angle to the cup longitudinal axis) creates a far-field pattern that expands the effective viewing cone, providing adaptability for various mounting scenarios while the mounting process itself remains straightforward
Solution Approach 2:
By changing the emission angle parameter through chip rotation, the patent achieves wider viewing angles (both horizontal and vertical) that enhance adaptability for different display applications and mounting positions. The parameter modification is achieved through a simple rotational adjustment during assembly, avoiding complex mounting configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in improved picture intensity and quality by optimizing light emission patterns, reducing light absorption, and maintaining consistent image quality at different viewing angles, even for large displays, while allowing for more flexible and cost-effective mounting solutions.
Implementation Method 1
Light emitting diodes (LED or LEDs) are solid state devices that convert electric energy to light, and generally comprise one or more active layers of semiconductor material sandwiched between oppositely doped layers. When a bias is applied across the doped layers, holes and electrons are injected into the active layer where they recombine to generate light.
Implementation Method 2
The reflective cup 13 may be filled with an encapsulant material 16 and a wavelength conversion material, such as a phosphor, can be included over the LED chip or in the encapsulant. Light emitted by the LED at a first wavelength may be absorbed by the phosphor, which may responsively emit light at a second wavelength.
Implementation Method 3
a single LED chip 12 is mounted on a reflective cup 13 by means of a solder bond or conductive epoxy
Data Source
AI summary
The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis. LED displays according to the present invention comprise a plurality of LED packages, at least some of which have an LED chip mounted in a reflective cup at different angles to achieve the desired display FFP.