Angled LED Chip Layout for Uniform Far-Field Color Balance
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Solution Overview
Problem
Conventional LED packages with multiple LED chips mounted at the same angle suffer from uneven light distribution and color balance variations when viewed from different angles, particularly when chips emit different colors.
Innovation Solution
The LED package design features LED chips mounted at different angles relative to each other, either pitched inwards or outwards, on a housing with angled surfaces or lead frame pins, and optionally includes a light collector or lens to modify the far-field emission pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED chips are mounted at the same angle on a flat surface, then the manufacturing process is simple, but the light distribution varies depending on viewing angle
Solution Approach 1:
The patent applies asymmetry by mounting LED chips at different angles relative to each other on the submount, rather than all parallel. This asymmetric angular arrangement causes light emissions from different chips to overlap more uniformly in the far-field, resolving the viewing angle dependency issue while maintaining manufacturing simplicity through standardized mounting processes.
Solution Approach 2:
The patent introduces angular dimensionality variation by tilting LED chips at different angles on the submount surface. This adds an angular dimension to the mounting configuration, transforming the light emission pattern from angle-dependent to angle-independent, thereby achieving uniform light distribution across different viewing angles.
2Adaptability or versatility
If LED chips emit different colors, then color variety is achieved, but color balance varies with viewing angle
Solution Approach 1:
The patent uses asymmetric angular mounting of differently colored LED chips to achieve uniform color balance. By arranging chips of different colors at specific different angles, the light emissions overlap in a way that maintains consistent color proportions across various viewing angles, preventing color shift.
Solution Approach 2:
The patent changes the mounting angle parameter for each LED chip based on its color and position. This parameter variation optimizes the far-field light overlap pattern, ensuring that color balance remains consistent across different viewing angles while maintaining the ability to provide diverse color output.
3Illumination intensity
If LED chips are pitched inwards or outwards at different angles, then light distribution uniformity is improved, but the mounting structure becomes more complex
Solution Approach 1:
The patent applies local quality by giving different angular orientations to different LED chips based on their specific positions and color characteristics. Each chip's mounting angle is locally optimized to contribute to the overall uniform light distribution, rather than using a uniform mounting approach for all chips.
Solution Approach 2:
The patent achieves multi-functionality through the angled mounting arrangement, which simultaneously accomplishes uniform light distribution, consistent color balance, and optimized far-field emission patterns. The same angular variation strategy serves multiple optical performance goals, reducing the need for additional separate optical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light distribution and color balance consistency across different viewing angles by optimizing the overlap of light emissions from LED chips of varying colors, resulting in improved illumination characteristics.
Implementation Method 1
When a bias is applied across the doped layers, holes and electrons are injected into the one or more active layers where they recombine to generate emissions such as visible light or ultraviolet emissions
Implementation Method 2
Lumiphoric materials, such as phosphors, may also be arranged in close proximity to LED emitters to convert portions of light emissions to different wavelengths
Data Source
AI summary
Light-emitting diode (LED) packages and more particularly LED packages that have LED chips mounted at different angles with respect to each to modify a far-field emission pattern are disclosed. The LED chips in the LED package can either be pitched inwards so that the light emissions from the LED chips generally overlap, or the LED chips can be pitched outwards. The LED chips can be mounted on a floor of a housing that has a plurality of angled surfaces. In other embodiments, the LED chips can be mounted on a platform in the housing that has different angled surfaces. In other embodiments, the LED chips can be mounted on one or more lead frame pins that can be angled, or angled with respect to other lead frame pins. The LED package may also include a light collector or a lens in order to further modify the far-field emission pattern.