Angled Mask Multi-Plane Deposition for Flexible Z-Direction Interconnects
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Solution Overview
Problem
Through-silicon vias for signal routing between electrical circuit dies, chips, or laminate board levels in the z-direction have structural and design/fabrication limitations, limiting flexibility in signal routing due to early-stage integration requirements.
Innovation Solution
A multi-plane material deposition system that includes a conductive material deposition device and a mask with angled sides to facilitate simultaneous deposition of conductive material on multiple surfaces of an electronic device substrate, allowing for adaptable interconnect positioning and modification without redesigning commercial-off-the-shelf devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-silicon vias are used for signal routing, then z-direction signal transmission is achieved, but design flexibility is limited due to early-stage integration requirements
Solution Approach 1:
The patent applies preliminary action by depositing conductive material on multiple surfaces (top, bottom, and sidewalls) of the substrate simultaneously during the fabrication process. This allows interconnect structures to be pre-positioned on all surfaces before final assembly, enabling flexible routing decisions to be made early in the design phase without limiting adaptability in later stages. The multi-plane deposition creates ready-to-use conductive pathways that can be configured flexibly during system integration.
Solution Approach 2:
The patent transitions from traditional planar (2D) routing to three-dimensional (3D) routing by utilizing sidewall surfaces in addition to top and bottom surfaces. The angled mask structure enables conductive material deposition on vertical sidewalls, creating interconnect pathways in the z-direction. This dimensional expansion provides additional routing dimensions and pathways, significantly increasing design flexibility for signal routing between stacked devices.
2Stability of the object's composition
If silicon vias are integrated early in chip design, then structural stability is improved, but routing flexibility is reduced
Solution Approach 1:
The patent segments the interconnect structure into multiple independent conductive regions deposited on different surfaces (top surface conductive regions, bottom surface conductive regions, and sidewall conductive regions). Each segment can be independently positioned and configured on its respective surface. This segmentation allows the structure to maintain stability on each surface while providing flexible routing options through the combination of segments in three-dimensional space.
Solution Approach 2:
The multi-plane deposition system creates conductive structures that serve multiple functions simultaneously: top surface regions provide planar routing, bottom surface regions provide alternative routing paths, and sidewall regions enable vertical z-direction connections. This multi-functionality allows a single fabrication process to produce versatile interconnect structures that can adapt to various routing requirements while maintaining structural stability.
3Productivity
If commercial-off-the-shelf devices are used, then manufacturing efficiency is improved, but adaptability for custom interconnect positioning is reduced
Solution Approach 1:
The patent changes the spatial parameters of conductive material deposition by utilizing multiple planes and angles. The angled mask structure deposits material at specific angles onto sidewall surfaces, creating interconnect structures at precise three-dimensional positions. This parameter control allows custom interconnect positioning to be achieved during the fabrication of commercial-off-the-shelf devices, enabling adaptability without sacrificing manufacturing efficiency. The process can be integrated into existing fabrication workflows while providing customized routing solutions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible and adaptable signal routing by allowing on-the-fly changes in circuitry design and positioning, enabling z-direction interconnects in existing devices without modification, enhancing the flexibility and efficiency of electronic device fabrication.
Implementation Method 1
a conductive material deposition device configured for deposition of a conductive material
Data Source
AI summary
An electronic device fabrication system may include, but is not limited to: a conductive material deposition device configured for deposition of a conductive material; at least one electronic device substrate configured to receive deposited conductive material; and at least one mask configured to selectively transmit the conductive material to the electronic device substrate, wherein the at least one mask configured to selectively transmit the conductive material to the electronic device substrate includes: at least a first side disposed at an angle relative to an adjacent second side.