Angled Memory Device Mounting on PCB to Reduce Routing Space
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Solution Overview
Problem
Existing memory module designs for computer systems require significant routing space on printed circuit boards (PCBs) due to the need for wide bus lines to connect Rambus DRAM devices, leading to increased signal attenuation and reduced product density.
Innovation Solution
The method involves mounting Rambus DRAM devices on a PCB such that their base lines are angled at specific angles (0°, 45°, 90°, 135°, and 180°) relative to the PCB's axis of elongation, reducing the length of bus lines and unnecessary routing space, thereby minimizing signal attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wide bus lines are used to connect Rambus DRAM devices to tabs on PCB ends, then impedance matching is improved, but transmission line width increases and signal attenuation increases
Solution Approach 1:
The patent changes the mounting orientation of Rambus DRAM devices from parallel to the PCB axis to angled orientations (0°, 45°, 90°, 135°, 180°). This dimensional change in mounting angle allows bus lines to connect more directly between devices and tabs, reducing transmission line length and signal attenuation while maintaining impedance matching through optimized routing paths.
Solution Approach 2:
The patent employs dynamic routing strategies where bus lines are routed differently depending on the mounting angle of individual devices. This allows the transmission path to adapt to each device's orientation, optimizing both impedance matching and minimizing signal loss for each specific connection.
2Ease of manufacture
If memory devices are mounted with parallel alignment to PCB axis, then manufacturing simplicity is maintained, but routing space increases and product density decreases
Solution Approach 1:
The patent introduces asymmetric mounting angles (0°, 45°, 90°, 135°, 180°) for Rambus DRAM devices relative to the PCB axis. This asymmetric arrangement optimizes the use of PCB routing space by allowing bus lines to connect more directly between devices and tabs, reducing unnecessary routing space and increasing product density while remaining manufacturable.
Solution Approach 2:
By transitioning from a single parallel mounting orientation to multiple angled orientations, the patent utilizes the angular dimension to optimize space utilization on the PCB, thereby increasing product density without significantly complicating the manufacturing process.
3Adaptability or versatility
If transmission line length is increased to accommodate device spacing, then device placement flexibility is improved, but signal attenuation increases
Solution Approach 1:
The patent employs dynamic routing optimization where the bus line path is adapted to each specific device mounting angle. This allows the system to achieve both device placement flexibility and minimized transmission line length by routing signals along optimized paths that account for each device's angular position, thereby reducing signal attenuation.
Data Source
AI summary
A memory module and a method of mounting memory devices on a PCB to form the memory module substantially reduce unnecessary routing space and improve signal attenuation characteristics. In the method of mounting and sequentially connecting at least two memory devices on a printed circuit board (PCB) having an axis of elongation to form a memory module, at least one of the memory devices is mounted on at least one face of the PCB so that a base line along an longitudinal axis of the at least one memory device lies at an acute angle with respect to the axis of elongation of the PCB.