Printed Circuit Assembling TRIZ Cases

One-step thermoforming and lamination creates a compact 3D LCP circuit board with sealed membrane switch recesses and faster manufacturing.

A temporary fixing film and lower-softening antioxidation layer hold fine-pitch components in place and suppress soldering defects during reflow.

Dielectric liquid immersion replaces metallic spacers so adjacent PCB chips can be packed closer while controlling heat and voltage drop.

An embedded die in a PCB uses a metal recess, solder joint, and fused dielectric layer to cut thermal resistance while maintaining electrical insulation.

A rigid-flex circuit links the IC and port connectors across the PCB to cut signal loss and preserve signal integrity in network hardware.

Depth-controlled grooves and guided magnetic assembly cut reflow steps and alignment errors in compact out-of-plane ASIC power modules.

A modular ultrasonic weld head and pin supply improve conductive pin alignment, flexibility, and welding efficiency for power and battery modules.

Integrated conductive PCB layers and a capacitor replace surface-mounted couplers and shield cans, reducing space while maintaining signal coupling.

A carrier-based self-aligned interconnect layout replaces silicon bridges to control chip spacing, cut packaging cost, and maintain reliable links.

A recessed substrate and overhanging die layout cuts RF package footprint while preserving high filter density in a compact assembly.

A trapped-contact ground plane improves fine-pitch separable connections by lowering compression force, shielding high-speed pins, and aiding thermal management.

Light-absorbing and reflecting patterns in a pressurization mask improve die solder heating efficiency while limiting substrate warpage.

Pre-annealed eutectic bonding creates ohmic contact while preserving a smooth mounting surface and avoiding heat damage to the drive circuit board.

By sizing the resin-to-bump gap for thermal expansion, this circuit module lets gas escape during mounting and prevents open defects.

Folded FPC pins inserted into PCB through-holes simplify battery electronics assembly while improving alignment, speed, and connection reliability.

A single soldering step uses thick paste and ultra-thin preforms to tailor power module joints for different stress and reliability needs.

Pressureless Cu paste and a perforated bond portion improve terminal-to-circuit bonding strength while reducing voids and pattern damage.

Soldered metallic portions and through-hole solder let a waveguide mount precisely to a PCB while improving electrical sealing and heat conduction.

A dual-board module with support members exposes both heat-radiation surfaces, improving cooling and preventing resin adhesion during molding.

Non-conductive protrusions taller than connection terminals help fine-pitch wiring boards prevent shorts and surface damage during manufacture.

Capacitive ground coupling replaces galvanic contact in a coax-to-PCB interface to cut PIM, simplify assembly, and reduce insertion loss.

A cured molded layer replaces ink on the circuit board to improve heat dissipation, surface flatness, and chip assembly in camera modules.

Cell-based balancing of metal pad area keeps large flip-chip BGA bump regions flatter, reducing height variation and substrate defects.

A two-part resin links components of different heights, making terminals flush while reducing fill resin and improving insulation.

A printed RC filter on the connector bracket grounds cable shielding currents to cut EMI without adding separate filter hardware.

A removable cap lets one card connector support different contact counts while adding strength to prevent shipping damage.

Using an alumina interposer with fired Cu and glass layers reduces board deflection and vibration noise while supporting stable electronic mounting.

A heat-resistant welding plate shields the switch module during PCB soldering, preventing deformation, internal damage, and poor contact.

Pre-transfer inspection leaves defective electronic elements behind, enabling selective laser transfer and higher yield in miniaturized device assembly.

Gas cells and glass fillers lower dielectric constant in polymer resin, enabling faster signal transmission without costly low-k materials.

An interleaved BGA power-ground layout preserves via space in smaller IC packages while reducing parasitic inductance, impedance, and voltage drop.

Elastic RF connectors embedded in the cavity filter body cut antenna height, ease PCB mounting, and keep frequency response uniform.

Prepreg resin flows around inserted PCB components during compression, avoiding added cover layers to reduce thermal stress and board thickness.

MXene and MAX particles help solder-bonded conductors resist metallization dissolution while preserving conductivity and avoiding extra plating steps.

Spaced insulating members raise pad-to-device clearance so de-flux solution can penetrate fine-pitch semiconductor packages without residue.

Interwoven high- and low-band folded patch radiators share one aperture to maintain beamforming performance while reducing terminal size and weight.

A recessed PCB cable connector uses side conductor insertion and rear heat access to cut parts, save space, and simplify automated assembly.

Two separate battery cells share one upright PCB-based PCM, cutting pack length while preserving cell protection and freeing space for capacity.

Curved substrate conductive structures offset reflow warpage, improving solder joint planarity and reducing non-wetting and head-in-pillow defects.

Line grooves in the lower metal layer create air gaps for convection, reducing ceramic substrate warpage while improving chip heat dissipation.

A printed RC filter on the connector bracket shunts shield-layer induced currents to ground, cutting EMI without extra filter hardware.

Pre-cut adhesive pieces with openings around mounted components enable full lamination, boosting bond strength while reducing lamination steps.

A variable-thickness coating on conductive particles helps connect display pads to PCB leads while reducing short-circuit risk.

A two-part mandrel press contact cuts PCB assembly stress and avoids solder failures in high-current connections under temperature swings.

Through-substrate power and signal wiring cuts power loss while preserving a large component mounting area on the main substrate.

A nickel connection piece bridges copper traces and aluminum bus bars to avoid brittle intermetallics, improve joining strength, and ease alignment.

A low-expansion support substrate and penetrating conductors keep optical waveguides aligned under heat while preserving reliable electrical links.